Imec, Belgium, and EV Group, Tempe, Ariz., announce an extension to their successful collaboration, achieving excellent wafer-to-wafer overlay accuracy results in both hybrid bonding and dielectric bonding.
MTI Instruments, Albany, N.Y., introduces the MTII/Fullam SEMtester compact mechanical test system, which is specifically designed to fit inside scanning electron microscopes.
Malvern Instruments, England, and Panalytical, The Netherlands, announce that on January 1 they merged their activities to grow the materials characterization business within the Materials Analysis segment of parent company Spectris.
Researchers at the Massachusetts Institute of Technology’s Lincoln Laboratory, Cambridge, report that they have developed a microscope in which optical microscopy is combined with laser spectroscopy to enable identification of individual micron-sized particles.
Future Market Insights (FMI), Valley Cottage, N.Y., releases its latest report on the semiconductor assembly and testing services market, predicting that it will primarily be driven by the surging demand for high-end packaging solutions.
