Applied Materials Inc., Santa Clara, Calif., announces that it has collaborated with Samsung Electronics Co. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.
Imec, Belgium, has announced a joint development project with Coventor, Cary, N.C., that will enable faster and more optimized development of advanced manufacturing technology in the 3D device architecture era, extending down to Imec’s 10- and 7-nm processes.
Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., announces that Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Inc., has joined SRC’s Trustworthy and Secure Semiconductors and Systems (T3S) program.
Craic Technologies, San Dimas, Calif., announces Spectral Surface Mapping (S2M) software for its UV-visible-NIR microspectrophotometers.
Bruker microCT, Belgium, introduces the SkyScan 1172, a high-resolution desktop microtomography (micro-CT) system for 3D nondestructive X-ray imaging of an object’s internal microstructure.
