Indium Corp., Utica, N.Y., has developed SACm, a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling.
Applied Materials Inc., has developed its Applied Endura Volta CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films.
Finetech, Gilbert, Ariz., has been selected by the Georgia Tech Packaging Research Center (PRC), Atlanta, to provide its semi-automatic Matrix bonder to demonstrate the first manufacturable, low-temperature, ultra-fine-pitch copper interconnect and assembly technology.
Sematech, Albany, N.Y., announces that its researchers have reached a significant milestone in reducing to zero the defects generated by tools from the multi-layer deposition of mask blanks for extreme ultraviolet lithography.
Cascade Microtech Inc., Beaverton, Ore., has developed the CM300 Probe System, which automates on-wafer device measurements and enhances device and process characterization and modeling by capturing the true electrical performance of devices, thus enabling hands-off productivity.
