Researchers at Michigan State University, East Lansing, report that by shooting an ultrafast laser pulse into a semiconductor, its properties change as if it had been chemically doped.
Progressive Surface, Grand Rapids, Mich., recently installed three 100HE plasma spray systems in a semiconductor manufacturing facility.
Picosun Oy, Finland, and Carleton University, Ottawa, have collaborated to develop a process in which atomic layer deposition (ALD) technology deposits thin uniform gold films on complete silicon wafers.
Researchers at the Georgia Institute of Technology have developed a protocol using multi-scale modeling to determine tensile yield strength from microindentation tests. Micro indentation offers all the advantages of a high-throughput measurement technique.
H.C. Starck, Newton, Mass., introduces the Ultra 76 Plus tantalum alloy, which is designed to combat aggressive hazardous-chemical corrosion in hot concentrated acids.
