Hamamatsu Photonics, Japan, developed the iPHEMOS-DDX, an inverted emission microscope designed for failure analysis of advanced semiconductor packages, including AI chiplets, high bandwidth memory, 2.5D/3D packages, and large-scale semiconductor packages. The system enables flexible integration into existing tester-based measurement environments while improving failure analysis workflows and reducing analysis time.
The system adopts a structure that enables direct docking to a tester from three directions, allowing rapid construction of a tester-centric EFA environment while improving layout flexibility and reducing setup time.
Its high-stability design minimizes temperature drift and vibration under both ambient and cooled operating conditions, enabling stable, long-term analysis of large and thermally sensitive semiconductor packages.
Its platform integrates seven analytical techniques, including PEM, Thermal/LIT, LSM, OBIRCH, DALS, EOP/EOFM, and TD Imaging, enabling an entire FA workflow to be performed on a single system.
The iPHEMOS-MPX superimposes the emission image on a high-resolution pattern image to localize defect points quickly. The contrast enhancement function makes an image clearer and more detailed.
TD Imaging is a new technology suitable for identifying defects in semiconductors with complex structures, such as logic semiconductors. It is an available option to pinpoint defects in semiconductors that contain metal parts internally.
The Solid Cold Emmi-X camera is a photoemission analysis camera featuring solid cold cooling, a linear cooling mechanism. It offers higher stability and easier maintenance than LN₂-based systems. It combines a wide field of view with a high S/N sensor and high-speed wavelength switching to enable ultra-low-level emission detection. This allows efficient, high-uptime analysis of advanced logic and high-density memory devices.
Image – Inverted emission microscope iPHEMOS-DDX.
For more information:
Hamamatsu Photonics K.K
https://www.hamamatsu.com/
