3D-Micromac AG, Germany, highlighted its microPREP L laser-based sample preparation system at SEMICON West. Designed for advanced semiconductor failure analysis and quality assurance, microPREP L supports sample sizes ranging from individual dies up to whole 12-inch (300-mm) wafers and system-level boards.
Its large-format capability enables engineers to process regions of interest directly on full wafers and system-level boards without first cutting them into smaller pieces. Depending on the application, laser processing can provide sufficient access for inspection or serve as a high-speed front-end step, offloading material removal from costly analytical tools such as ion beam systems so they can focus on final polishing, imaging, and high-resolution analysis.
microPREP L further increases productivity through recipe-driven automation that enables multiple preparation tasks to run sequentially and unattended at different locations across the same wafer or board. Real-time in-situ depth sensing monitors material removal during processing, reducing iterative process-measure-reprocess cycles and helping speed time-to-sample.
Integrated 3D imaging and measurement enables topographic mapping between processing steps, allowing users to precisely target areas for laser processing, verify resulting dimensions and geometries, and continue processing based on the measurement data. An optional sealed process chamber also supports processing under vacuum or an inert atmosphere for applications requiring controlled environmental conditions. Additional options include cryogenic processing for temperature-sensitive materials and chemically assisted laser processing aimed at improving surface quality and process efficiency.
Image – The laser sample preparation tool microPREPL by 3D-Micromac AG can prepare samples on whole 12-inch (300-mm) wafers and system-level boards at different locations of the sample within a single process run. Courtesy of: 3D-Micromac AG.
For more information:
3D-Micromac AG
http://www.3d-micromac.com
