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Electronic Device Failure Analysis (EDFA)

Electronic Device Failure Analysis™ (EDFA™) is a high demand quarterly technical resource for the modern failure analysis professional. Published in both print and digital versions, each issue covers:
  • Contributed technical articles that cover everything from operations to techniques
  • Insight into trends in the microelectronics FA industry, to keep you up-to-date
  • New product announcements
  • Recognition of outstanding contributions to the field of FA
  • Looking to update some skills?  The Training Calendar provides an easy way to know what courses are coming up in the months ahead.
  • News of the Electronic Device Failure Analysis Society.
  • Guest Columns provide that vital perspective into other FA

All EDFAS members receive free access to the EDFA Magazine Digital Edition and EDFA Technical Articles as a membership benefit.

If you’d like to purchase a subscription to EDFA magazine, please contact us at [email protected] or by phone at 440.462.0292. 

EDFA Author Guidelines (pdf)

EDFA Guest Editorial & Columnist Guidelines (pdf)

EDFA Sample Article (pdf)

Interested in advertising in EDFAS Magazine? There are many opportunities available! View our Media Kit to learn more about these advertising opportunities, or contact Kelly “KJ” Johanns, ASM Business Development Manager. 

 

EDFA Editorial Board

Nicholas Antoniou, KLA, Milpitas, CA, USA
Felix Beaudoin, Immediate Past Chair, GlobalFoundries, Malta, NY, USA
Navid Asadi, University of Florida, Gainesville, FL, USA
Guillaume Bascoul, CNES-French Space Agency, Toulouse, France
Mike Bruce, Past Chair, Independent Consultant, Austin, TX, USA
Jiann Min Chin, AMD Singapore, Singapore
Michael DiBattista, Varioscale Inc., San Marcos, CA, USA
Rosine Coq Germanicus, Universite de Caen Normandie, France
Szu Huat Goh, Qualcomm, Singapore
Jason Holm, NIST, Boulder, CO, USA
Ted Kolasa, Northrop Grumman Space Systems, Scottsdale, AZ, USA
Joy Liao, NVIDIA, San Jose, CA, USA
Rose Ring, Past Chair, NenoVision, Czech Republic
Tom Schamp, E-Space, Dallas, TX, USA
David Su, Yi-Xiang Investment Company, Hsinchu City, Taiwan
Martin Versen, University of Applied Sciences Rosenheim, Germany
Joanne Miller, Senior Editor, ASM International, Materials Park, OH, USA
Vicki Burt, Managing Editor and ASM Staff Liaison, ASM International, Materials Park, OH, USA

EDFA Founding Editors

Ed Cole, Sandia National Laboratories, Albuquerque, NM, USA
Larry Wagner, LWSN Consulting, Plano, TX, USA

Advanced Materials & Processes, Volume 184, Issue 5, September 2026 (ASM International)
The September 2026 issue of Advanced Materials & Processes magazine has an editorial focus on Advanced Manufacturing.
Cover of EDFA August 2026
Electronic Device Failure Analysis, Volume 28, Issue 3, August 2026
The August 2026 issue of Electronic Device Failure Analysis includes: Expanding the Application Range of EBIRCH; Moisture and Microelectronic Devices; Automated End-to-End AI Solution for PEM; and Building Today’s Microelectronics Workforce.
Advanced Materials & Processes, Volume 184, Issue 4, July 2026 (ASM International)
The July 2026 issue of Advanced Materials & Processes magazine has an editorial focus on Testing and Characterization.
Advanced Materials & Processes, Volume 184, Issue 3, May 2026 (ASM International)
The May 2026 issue of Advanced Materials & Processes magazine has an editorial focus on Aerospace Materials and Testing.
Electronic Device Failure Analysis, Volume 28, Issue 2, May 2026
The May 2026 issue of Electronic Device Failure Analysis includes: Electrical Fault Localization of Interconnect Via Chains; Inspection and Metrology Challenges in Hybrid Bonding; Failure Analysis Roadmap: Die-Level Council Update; and Advanced Fault Isolation of USB2 ESD Failures.
Advanced Materials & Processes, Volume 184, Issue 2, March 2026 (ASM International)
The March 2026 issue of Advanced Materials & Processes magazine has an editorial focus on Additive Manufacturing.
Electronic Device Failure Analysis, Volume 28, Issue 1, February 2026
The February 2026 issue of Electronic Device Failure Analysis includes: A Step Toward Automation in Failure Analysis; Advanced FA using In-Situ AFM in FIB-SEM; Enhancing Soft Defect Localization; and Highlights from ISTFA 2025.
Advanced Materials & Processes, Volume 184, Issue 1, January 2026 (ASM International)
The January 2026 issue of Advanced Materials & Processes magazine has an editorial focus on Emerging Analysis Methods.
Advanced Materials & Processes, Volume 183, Issue 8, November/December 2025 (ASM International)
The November/December 2025 issue of Advanced Materials & Processes magazine has an editorial focus on Testing and Characterization.
Electronic Device Failure Analysis, Volume 27, Issue 4, November 2025
The November 2025 issue of Electronic Device Failure Analysis includes: Chiplet Architectures for Scalable Integration; Thermal Approaches to Fault Isolation in 3D Structures; Avoiding Device Degradation through Nanoprobing; and FA Chatbot with Retrieval-Augmented Generation.