EDFA Magazine
Volume 28, Issue 1, February 2026
The February 2026 issue of Electronic Device Failure Analysis includes: A Step Toward Automation in Failure Analysis; Advanced FA using In-Situ AFM in FIB-SEM; Enhancing Soft Defect Localization; and Highlights from ISTFA 2025.
SUBSCRIBE TO THE AM&P PRINT EDITION
US members receive a year's subscription to the print edition free with their membership. International members pay a $30 shipping charge per year.
Recent past editions
Volume 28, Issue 3, August 2026
Magazine (Global)
Volume 28, Issue 2, May 2026
Magazine (Global)
Volume 27, Issue 4, November 2025
Magazine (Global)
Volume 27, Issue 3, August 2025
Magazine (Global)

