EDFA Magazine
Volume 27, Issue 4, November 2025
The November 2025 issue of Electronic Device Failure Analysis includes: Chiplet Architectures for Scalable Integration; Thermal Approaches to Fault Isolation in 3D Structures; Avoiding Device Degradation through Nanoprobing; and FA Chatbot with Retrieval-Augmented Generation.
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Recent past editions
Volume 28, Issue 3, August 2026
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Volume 28, Issue 2, May 2026
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Volume 28, Issue 1, February 2026
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Volume 27, Issue 3, August 2025
Magazine (Global)