Suss MicroTec, Germany, recently introduced a coater/developer tool especially developed to process wafers for fan-out wafer-level packaging applications. Based on industry proven ACS300-technology, it is a modular cluster system designed to meet the need for clean, reliable, and high-throughput photolithography applications.
With this coater/developer system, artificially created wafers, which can be larger than 300 mm, can be processed. On embedding chips on an artificial wafer, a certain space has to be ensured between the individual dice, for instance to allow for Fan-Out redistribution layers (RDL). This enables the formation of nearly as many micro-bumps per microchip as wanted, regardless of the size of the single chip. It is an enhancement of the standard packaging solutions for highly integrated microchips.
“We have developed new solutions and processes for cost efficient and high throughput applications for Fan-Out Wafer-Level Packaging,” says Frank P. Averdung, President and CEO of SUSS MicroTec. “Our tailor-made solutions allow customers to move beyond standard processes and applications to drive the technological development in the semiconductor industry further.”
