Rogers Corp., Chandler, Ariz., will highlight its wide range of circuit materials at the 2017 IEEE International Microwave Symposium in June. The company will also offer guidance to visitors on the optimum use of those materials for circuits ranging from high-speed and high-frequency bands through millimeter-wave frequencies. Its circuit materials include Kappa 438 laminates, RO1200 laminates, RO4730G3 laminates, and 92MLlaminates and prepregs.
Kappa 438 laminates feature low loss, excellent dielectric constant (Dk) tolerance, and tight thickness control, and are engineered for outstanding, repeatable wireless performance. These laminates are compatible with conventional bondplies and lead free solder processes, and have the UL 94 V-0 flame retardant rating. A design Dk of 4.38 tailored to FR-4 industry standard norms facilitates ease of converting existing FR-4 designs where better electrical performance is needed.
RO1200 circuit materials are engineered to meet the unique electrical and thermal/mechanical demands of high speed designs. These materials enable system designers the flexibility to design leading edge systems that maximize data throughput and minimize latency in performance demanding applications.
RO4730G3 UL 94 V-0 antenna grade ceramic hydrocarbon laminates combine a flame retardant, low loss thermoset dielectric with patented LoPro copper foil, and incorporate a proprietary filler system that brings to market solutions for current macro base station antenna designs on traditional and active antenna arrays, and PCB antennas solutions for those about to come, such as 5G infrastructure.
92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. These thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics.
