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Purdue and Taiwan Semiconductor join to build secure semiconductor pipeline

Purdue University, West Lafayette, Ind., and the Taiwan Semiconductor Manufacturing Co. (TSMC), jointly announce plans to establish a Center for Secured Microelectronics Ecosystem. The goal is to ensure a secure supply of semiconductor chips and related tools all the way from the foundry to the packaged system.

 

TSMC, the world’s largest semiconductor contract manufacturer, and officials from Purdue University reached an agreement in Washington, D.C., during the Select USA Conference. The center is to be located at the Purdue University campus, and the university will collaborate with the Purdue Research Foundation. They will carry out research to ensure a secure ecosystem for the manufacture of microelectronics systems.

 

“TSMC is pleased to have this opportunity to support Purdue’s world-class technology research,” said H.-S. Philip Wong, vice president of corporate research at TSMC. “As everyone’s trusted foundry, TSMC believes it would be beneficial to contribute to the development of a secure electronics ecosystem.”

 

The Purdue School of Electrical Engineering, with about ten faculty members currently collaborating with TSMC at various individual levels, will lead the research and development in conjunction with TSMC.

 

“We anticipate the new center will begin operations at the beginning of the new academic year,” said Mung Chiang, Purdue’s John A. Edwardson Dean of the Purdue College of Engineering.  “At the start, we will focus on developing a secure microelectronics ecosystem. We also anticipate that the partnership will grow in the next couple of years to include multiple United States universities.”

 

www.purdue.edu

 

www.tsmc.com/english 

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