Applied Materials Inc., Santa Clara, Calif., and the Institute of Microelectronics (IME), a research institute of Singapore’s Agency for Science, Technology and Research (A*STAR), announced a new phase of their research collaboration at the Center of Excellence in Advanced Packaging in Singapore.
As traditional Moore’s Law scaling slows, chipmakers and systems companies are increasingly looking to heterogeneous design and advanced packaging solutions to enable continued advances in power, performance, area, cost and time-to-market (PPACt). By combining chips of various nodes and functions in a single package, heterogeneous integration also enables smaller form factors and greater design and manufacturing flexibility.
An emerging form of heterogeneous integration called hybrid bonding connects chips and wafers with direct copper-to-copper bonding, thereby reducing wiring distances and increasing input/output (I/O) density. This improves power efficiency and enables greater system performance.
Under the new phase of their R&D engagement, Applied Materials and A*STAR’s IME aim to accelerate the AI era of computing by driving breakthroughs in heterogeneous integration and advanced packaging for semiconductor innovation. The parties have signed a five-year extension to their existing research collaboration and will make a new, combined investment of approximately USD$210 million to upgrade and expand the Center of Excellence in Advanced Packaging in Singapore to accelerate materials, equipment and process technology solutions for hybrid bonding and other emerging, 3D chip integration technologies.
For more information:
Applied Materials
Institute of Microelectronics A*STAR
