Samsung mass-producing 4-gigabit DDR4 devices via 20 nm-class process technology

Samsung Electronics Co. Ltd., Japan, is now mass-producing 4-gigabit (Gb) advanced DDR4 memory, for enterprise servers in next-generation data centers. Early market availability of the devices, which use 20 nm-class process technology, will facilitate demand for 16- and 32-gigabyte memory modules. This compares to conventional DRAM of which 8  gigabyte modules using a 30nm-class process technology are still commonplace.

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Russian aerospace and turbine industries receive support from Ipsen

With over 140 million consumers, and almost unlimited infrastructure needs, Russia remains one of the most promising markets for U.S. exporters. Within the last few months, Ipsen, Cherry Valley, Ill., has shipped eight TITAN furnaces to Russia for the civil aerospace and land-based turbine engine industries. These shipments were spread throughout Russia to cities including, but not limited to, Ufa, Perm, and Voronezh.

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Resistive memory based on zinc-oxide/silicon has higher speed, greater storage capacity

A team at the University of California, Riverside, has developed a novel way to build a zinc oxide nano-island on silicon. It eliminates the need for a second element called a selector, which is often a diode. The device is based on the principles of resistive memory, which can be used to create memory cells that are smaller, operate at a higher speed, and offer more storage capacity than flash memory cells, the current industry standard.

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Carnegie Mellon to develop next-gen silicon chips with $2.6 million NSF grant

Carnegie Mellon University’s Center for Silicon System Implementation, Pittsburgh,  has received a $2.6 million grant from the National Science Foundation to develop next-generation ultra-efficient silicon chips that could trigger a revolution in how chips are designed and operated. The three-year initiative involves eight faculty members who have expertise in a variety of areas that include circuit design, computer architecture, and integrated circuit chip manufacturing.

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IMS Members Named ASM Fellow

In 1969, ASM established the honor of Fellow of the Society to provide recognition to members for their distinguished contributions to materials science and engineering and to develop a broad based forum of technical and professional leaders to serve as advisors to the Society.  We are pleased to announce the following IMS members will be among the 2013 inductees.   Dr. Richard W.

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Edward Cole Named ASM Fellow

In 1969, ASM established the honor of Fellow of the Society to provide recognition to members for their distinguished contributions to materials science and engineering and to develop a broad based forum of technical and professional leaders to serve as advisors to the Society. We are pleased to announce EDFAS member and Past President, Dr. Edward I. Cole, Senior Scientist, Sandia National Laboratories, Albuquerque, NM, will be among the 2013 inductees.

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Support for women in STEM

Women now make up nearly half the workforce, yet only 23% of workers in STEM-related jobs are women. A way to combat this trend is to find support from peers in a formalized way.

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New POL converter module series introduced

Allegro MicroSystems LLC, Worcester, Mass., released a new POL converter module series. The BR200 series are thin POL converter modules with an industry standard exterior shape and footprint that are responsive to very high speed loads and compatible with ceramic capacitors. These POL converter modules have been designed with higher efficiency, increased power density and are offered in a thinner package that most competitive solutions on the market today.

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New medical alloy features higher x-ray visibility

Scientists and engineers from the Materials and Surface Science Institute (MSSI) at the University of Limerick, Ireland, invented a new metal that will make medical devices inside the body more visible under x-ray. Many medical devices, such as stents and valves, are placed in the body through minimally invasive surgical procedures that are usually performed with the help of medical imaging such as x-ray fluoroscopy. Current materials used to make these devices do not show up well under x-ray.

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TSS Members Named ASM Fellow

In 1969, ASM established the honor of Fellow of the Society to provide recognition to members for their distinguished contributions to materials science and engineering and to develop a broad based forum of technical and professional leaders to serve as advisors to the Society.  We are pleased to announce the following TSS members will be among the 2013 inductees.     Mr. Timothy McKechnie, President, Plasma Processes, Inc.

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Shape-memory polymer repeatedly reverses deformation

Researchers from the Institute of Biomaterial Science of the Helmholtz-Zentrum Geesthacht,  Germany, have developed shape-memory polymers that can repeatedly change from one shape to another and then back again when temperatures fluctuate within a selected range. This enables their use as actuators. Until now, polymers with temperature-controlled shape memory could change form only once.

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Volume rendering on mobile devices

Bruker microCT (Kontich, Belgium) introduces a newly developed volume rendering application for mobile devices operating under iOS, such as iPad, iPhone and iPod Touch. It is now available as a free download on the App Store.   Any 3D results obtained using SkyScan scanners can be sent to a mobile device for realistic visualization by real-time volume rendering with the possibility of 3D object manipulation, virtual cut, adjustments of object’s opacity and colors, etc.

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