New research to manufacture energy saving automobiles

A team of researchers from Wayne State University, Detroit, received a $350,000 award from the National Science Foundation for the project, “Failure Prediction and Reliability Analysis of Ultra-High Strength Steel Autobody Manufacturing Systems by Utilizing Material Microstructure Properties.”

Continue reading

Porous silicon oxide enables high-density computer memory

Rice University, Houston, announces that its breakthrough silicon oxide technology for high-density, next-generation computer memory is one step closer to mass production, thanks to a refinement that will allow manufacturers to fabricate devices at room temperature with conventional production methods.

Continue reading