Aurora Spine Corp., Carlsbad, Calif., announces that it has received U.S. Food and Drug Administration 510(k) clearance for sterile-packed titanium plasma spray coated (TiNano) spinal fusion implants.
Continue readingOerlikon to acquire Sulzer Metco for $1.1 billion
Oerlikon, Switzerland, has signed an agreement to acquire Sulzer Metco, a division of Sulzer, also of Switzerland, for approximately $1.1 billion.
Continue readingPPG Industries acquires assets of Hi-Temp Coatings Technology
PPG Industries, Pittsburgh, has reached a definitive agreement to acquire substantially all of the assets of Hi-Temp Coatings Technology Co. Inc., Boxborough, Mass.
Continue readingAdding beta-TCP to porous orthopedic implants reduces risk of infection
Researchers at Aalto University in Finland have developed a beta-tricalcium phosphate surface treatment for porous orthopedic and dental implants that will help reduce the risk of infection.
Continue readingAerospace sustainability study of industrial 3D printing
EOS collaborated with Airbus Group Innovations to complete an environmental lifecycle comparison of two key production technologies, rapid investment casting and DMLS.
Continue readingWearable medical device solutions
At MD&M West this week, Momentive Performance Materials Inc. (MPM), Waterford N.Y., is showcasing a fiber-reinforced liquid silicone rubber (LSR) for designers seeking ways to enhance wearable medical devices.
Continue readingPredicting new forms of insulating materials
Topological insulators have been of great interest to physicists in recent years because of unusual properties that may provide insights into quantum physics.
Continue readingRTI acquires Directed Manufacturing for additive manufacturing of titanium aerospace and medical products
RTI International Metals Inc., Pittsburgh, has acquired Directed Manufacturing Inc., Austin, Texas, a leader in additive manufacturing of metals and plastics for both commercial production and engineering development applications.
Continue readingWichita State acquires full-scale aircraft structural testing systems from MTS for aviation R&D
MTS Systems Corp., Eden Prairie, Minn., has sold an extensive array of state-of-the-art mechanical testing systems to Wichita State University’s National Institute for Aviation Research (NIAR).
Continue readingAlcoa Dura-Bright commercial truck wheel is ten times more resistant to corrosion
Alcoa, Pittsburgh, introduces the surface-treated Dura-Bright EVO commercial truck wheel, said to be ten times more resistant to corrosion that is primarily caused by road salts and weather.
Continue readingInvestment expand automotive aluminum capacity
Novelis Inc., Atlanta, will invest an additional $205 million to further expand its global manufacturing operations serving the rapidly growing automotive market.
Continue readingThyssenKrupp Aerospace acquires aerospace operations of Alimex Metallhandelsgesellschaft
ThyssenKrupp Aerospace will continue Alimex’s business of distributing and processing aluminum mill products (rod, sheet, plate) for the aviation industry.
Continue readingUddeholm SuperClean Concept PM tool steels resist abrasion, chipping, elevated temperatures
Uddeholm AB, Sweden, introduces Uddeholm SuperClean Concept powder metallurgy (PM) tool steels, building on the proven success of its current PM tool steel grades.
Continue readingScanning Microwave Impedance Microscopy for nanoscale mapping of permittivity and conductivity
Asylum Research, Santa Barbara, Calif., an Oxford Instruments company, has developed Scanning Microwave Impedance Microscopy (sMIM).
Continue readingCadence Incisive 13.2 verification platform enables faster performance
Cadence Design Systems Inc., San Jose, Calif., introduces a faster version of the Incisive functional verification platform.
Continue readingImec celebrates 30 years of nanoelectronics industry innovation
Imec, Belgium, celebrates its 30th anniversary. Founded in 1984 as a non-profit organization, it has enabled notable advancements in global semiconductor chip manufacturing in the three decades since its founding.
Continue readingInstrument measures silicon wafer thickness and TSV depths prior to grinding
Lasertec U.S.A., San Jose, Calif., introduces the WASAVI Series BGM300. This instrument measures silicon wafer thicknesses and TSV depths prior to back grinding 3D semiconductor devices.
Continue readingBruker stylus profiler enables 300-mm wafer analysis
Bruker Nanosurfaces Division, Billerica, Mass., introduces the Dektak XTL Stylus Profiler, extending its stylus profilometry capabilities to 200 and 300 mm semiconductor wafer fabs and next-generation touch panel manufacturers.
Continue readingIndustry consortium to develop secure semiconductors and systems
Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., has launched a new initiative on Trustworthy and Secure Semiconductors and Systems (T3S).
Continue readingAsylum Research announces the fourth Euro AFM Forum
Asylum Research, Santa Barbara, Calif., an Oxford Instruments company, in conjunction with Georg-August Universität Göttingen, Germany, announces the fourth Euro AFM Forum to be held March 17-19, 2014.
Continue readingTime-dependent spectroscopy enables monitoring microscopic samples
Craic Technologies, San Dimas, Calif., introduces Craic TimePro kinetic spectroscopy software. It is designed to be used with Craic Technology’s microspectrophotometers and their controlling Lambdafire software.
Continue readingMultiple memory chips connected in shingle-stack configuration with ultra-short wirebonds
Invensas Corp., San Jose, Calif., announces its latest xFD products solutions. The xFD technology connects multiple memory chips in a face-down shingle-stack configuration using ultra-short wirebonds.
Continue readingTapping energy from the sun through heat and light
A new approach to harvesting solar energy, developed by Massachusetts Institute of Technology, Cambridge, researchers, could improve efficiency by using sunlight to heat a high-temperature material whose infrared radiation would then be collected by a conventional photovoltaic cell.
Continue readingAcoustics and aesthetics merge with door opening system
Assa Abloy group brands Frameworks, Graham Wood Doors, and Maiman Wood Doors, New Haven, Conn., teamed up to launch Serenity, the first wood door and aluminum frame sound-rated door opening solution.
Continue readingNitiBrite Nitinol features one-step oxide removal
Johnson Matthey Medical Components, West Chester, Pa., has introduced NitiBrite Nitinol wire, which features an exclusive one-step oxide removal process that completely eliminates the toxic HF acid solutions that cause embrittlement. Unlike other methods used to create oxide-free Nitinol wire, the NitiBrite process does not involve acid etch or costly mechanical polishing.
Continue readingHigh-precision microriveting joins complex medical devices
Admedes Schuessler, Germany, has developed a superflat micro-riveting process technology for clinical applications that may require complex combinations of engineering materials. It is designed for tantalum and gold markers, and provides superior process features, such as high precision with minimum crevice formation, and super-flat 3D contouring. The process is scalable and flexible, and can be used with all types of radiodense materials.
Continue readingBose Electroforce electrodynamic test system features nanometer resolution
Bose ElectroForce, Eden Prairie, Minn., introduces two high-accuracy test systems: the ElectroForce 3200 Series III and the ElectroForce 3330 Series II test instruments. They achieve the highest measured displacement resolution and accuracy for electrodynamic test systems. With measurement resolution of a nanometer and accuracies in the range of microns, these systems extend the range of testing, providing an order of magnitude improvement in displacement measurement at low amplitudes.
Continue readingBurpee specializes in stents and stent-like devices of Nitinol and other materials
Burpee Materials Technology, Eatontown, N.J., specializes in high-yield, high-quality manufacturing of stents and stent-like devices and components. Expertise ranges from fine neurovascular and coronary devices to large AAA/TAA and valve components fabricated from Nitinol, cobalt-chrome, stainless steel, and other biocompatible metals.
Continue readingFort Wayne Nitinol wires exceed ASTM chemistry requirements
Fort Wayne Metals, Ind., manufactures wire products from several grades of Nitinol commonly used in medical applications, as well as Nitinol alloys for other applications. Each medical grade is comprised of near-equal atomic weight percentage of nickel and titanium. Our most common medical grade, NiTi#1, exceeds chemistry requirements set forth by ASTM F2063 for surgical implants. All grades are available in either the cold worked (CW) condition ready for heat treatment, or as straightened super-elastic (SE) wire.
Continue readingMemry’s Redox Nitinol alloy includes 80% fewer oxides
Memry Corp., Bethel, Conn., an SAES Getters Company, offers Nitinol products available in Redox, a new alloy with 80% fewer oxides and smaller particle size. The result is enhanced microcleanliness and enhanced confidence. The industry measures nitinol microcleanliness by the amount of non-metallic inclusions and porosity. Typical non-metallic inclusions are carbides (TiC), and intermetallic oxides (Ti4Ni2Ox). The size and distribution of inclusions like these play a critical role for device designers who work with nitinol.
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