Rice University scientists created a new paint they call “strain paint” and think it will help detect deformations in structures like airplane wings.
Continue readingImproving efficiency in flexible circuitry
Researchers at Stanford University, Calif., developed a process to create flexible chips that can tolerate power fluctuations in much the same way as silicon circuitry.
Continue readingEOS expands 3D printing materials with Ti64ELI and StainlessSteel 316L for medical devices
EOS of North America, Novi, Mich., expands its metal materials portfolio with EOS Titanium Ti64ELI and EOS StainlessSteel 316L.
Continue readingQuesTek to serve as research partner for lightweight materials innovation institute
QuesTek Innovations, Evanston, Ill., announces that it has been selected as a research partner by the U.S. Department of Defense under the Lightweight and Modern Metals Manufacturing Innovation (LM3I) solicitation.
Continue readingAmbrell induction heating equipment enables fast repeatable heating for aerospace manufacturers
Ambrell, an Ameritherm Company, Scottsville, N.Y., designs fast, repeatable, controllable, noncontact heating equipment with a minimal footprint that makes it an ideal solution for aerospace manufacturers.
Continue readingAviation seating to be made of magnesium for the first time
Magnesium Elektron, England, announces the first use of its proprietary Elektro 43 alloy in aviation seating.
Continue readingKyma Technologies licenses its aluminum nitride PVD technology to GT Advanced Technologies
Kyma Technologies Inc., Raleigh, N.C., announces that it has licensed its aluminum nitride PVD of nanocolumns technology to GT Advanced Technologies, Merrimack, N.J.
Continue readingPTFE/NanoDiamond coating doubles surface durability and reduces friction by up to 66%
Carbodeon, Helsinki, Finland, has released a new PTFE/NanoDiamond coating with twice the durability and up to 66% less friction than current products.
Continue readingTecnalia achieves NadCap accreditation for testing and surface treatments
Tecnalia Research & Innovation, Spain, has received Nadcap accreditation, which recognizes the company´s technical competence as a testing laboratory for control of surface treatment baths and also as testing on metal materials – mechanical, metallography and corrosion testing – in the aeronautical sector.
Continue readingTitanium 2014 call for papers
The International Titanium Association (ITA), Denver, Colo., has issued a “Call for Papers” to be presented at TITANIUM 2014, Sept. 21 – 24 at the Hilton Chicago.
Continue readingComponent repair and new production support for turbines
Chromalloy, Palm Beach Gardens, Fla., renewed a 10-year agreement with Solar Turbines Inc., San Diego, to provide component repairs and new production support for the manufacturer’s leading power systems.
Continue readingASM Announces Emerging Technologies Survey Results
ASM International’s Emerging Technologies Awareness Committee recently conducted a survey of several hundred ASM members to gain feedback on technologies that members believe will have the most impact on the future of materials science and engineering.
Continue readingAl-Fe Heat Treating Wabash installs automated control system to provide CQI 9 compliance
Al-Fe Heat Treating, Wabash, Ind., has installed a new control system that will allow it to provide CQI 9 compliance for its automotive customers.
Continue readingConstellium develops high-strength aluminum crash-management systems
Constellium N.V., Amsterdam, has launched high-strength aluminum crash management systems (CMS) for the front and the rear of a vehicle.
Continue readingWPI’s Metal Processing Institute named a core facility for manufacturing innovation
The Metal Processing Institute (MPI) at Worcester Polytechnic Institute (WPI), Mass., announces that it has been selected as one of four core academic facilities for the American Lightweight and Modern Materials Manufacturing Innovation Institute (LM3I).
Continue readingBruker Fourier 60 FT-NMR spectrometer stabilizes temperature to ±0.1°C
Bruker Corp., Billerica, Mass., introduces the Fourier 60, an entirely new permanent-magnet based, benchtop FT-NMR (Fourier Transform Nuclear Magnetic Resonance) spectrometer.
Continue readingIndium’s BiAgX high-melting-point lead-free solder paste designed for high reliability
Indium Corp., Utica, N.Y., has developed BiAgX high-melting-point lead-free solder paste for high-reliability electronics assembly.
Continue readingOxford Instruments acquires Andor
Oxford Instruments, U.K., recently acquired Andor, South Windsor, Conn., a market leading supplier of high performance cameras, microscope systems, and software for the physical science and life science industries.
Continue readingHeraeus introduces thick print copper paste system for circuits 20 to 350 microns thick
Heraeus Precious Metals, West Conshohocken, Pa., introduces a thick print copper paste system for power electronic applications where excellent reliability, thermal conductivity, and robust thermal cycling performance are required.
Continue readingSUSS MicroTec and IBM to collaborate on excimer technologies for semiconductor packaging
SUSS MicroTec, Germany, announces the extension of a joint development agreement with the IBM Corporation to further develop, enhance, and propel the application of excimer laser technologies in the realm of advanced semiconductor packaging, including 3D systems integration.
Continue readingSemiconductor equipment industry posts $1.38 billion in orders
SEMI, San Jose, Calif., reports that North America-based manufacturers of semiconductor equipment posted $1.38 billion in orders worldwide in December 2013 (three-month average basis) and a book-to-bill ratio of 1.02.
Continue readingBrewer Science introduces CNT inks without surfactants
Brewer Science, Rolla, Mo., introduces CNTRENE 4010, the first aqueous, surfactant-free, ready-to-use semiconducting carbon nanotube inks for microelectronics and printed electronics applications.
Continue readingMentor Graphics Veloce emulator targets verification of SoC integrated circuits
Mentor Graphics Corp., Wilsonville, Ore., announces that the Shanghai ZhangJiang Institute has adopted the Veloce 2 emulation system for its research and development activities targeting the functional verification of System-on-Chip (SoC) integrated circuit designs.
Continue readingCollaboration on aerospace sustainability study for industrial 3D printing
EOS, Krailling, Germany, is collaborating with Airbus Group Innovations (previously EADS Innovation Works), Novi, Mich., to complete an environmental lifecycle comparison of two key production technologies.
Continue readingFort Wayne Metals develops high-strength CP Grade 4 titanium medical implant wire
Fort Wayne Metals, Fort Wayne, Ind., introduces 4TiTude, the first medical implant wire to combine the benefits of pure titanium with the strength of Ti-6Al-4V ELI.
Continue readingMaterion introduces zirconium-base metallic glass alloys
Materion Corp., Mayfield Heights, Ohio, has introduced a bulk metallic glass product line based on zirconium.
Continue readingMicro-windmills to recharge cell phones
A University of Texas-Arlington research associate and electrical engineering professor designed a micro-windmill that generates wind energy and may become an innovative solution to cell phone batteries.
Continue readingAllegheny Technologies acquires Dynamic Flowform for capabilities in the aerospace and oil/gas industries
Allegheny Technologies Inc., Pittsburgh, has acquired Dynamic Flowform Corp., Billerica, Mass., which fabricates thin-walled tubular components in net or near-net shapes by a precision flowforming process.
Continue readingIBC Advanced Alloys to collaborate with Nu-Cast on Be-Al investment casting projects for aerospace
IBC Advanced Alloys Corp., Vancouver, has signed a non-binding memorandum of understanding with Nu-Cast Inc., Londonderry, N.H., to collaborate on new beryllium-aluminum investment casting projects and opportunities, initially for the aerospace sector.
Continue readingAluminum products producer Aleris acquires sheet producer Nichols Aluminum
Aleris, Cleveland, Ohio, has signed a definitive agreement to acquire Nichols Aluminum, LLC, a wholly owned subsidiary of Quanex Building Products Corp.
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