Industries and Applications Archives - Page 77 of 114

3D-printing brings Rembrandt back to life (with video)

ING, the Netherlands has unveiled an ambitious project that claims to bring Dutch master Rembrandt “back to life” via a 3D-printed painting.

ID Gun sprays metal and ceramic abrasion-resistant coatings inside pipes and tubes

Saint-Gobain Coating Solutions, Worcester, Mass., introduces its ID Gun equipment, which produces high-performance wear resistant coatings inside long pipes, tubes, and sleeves with diameters greater than six inches.

Oerlikon expands presence in South Korea

The Surface Solutions Segment of the Oerlikon Group, Switzerland, announces that Oerlikon Metco will cover the Korean market directly by taking over Metco Business, its previous distribution partner.

Höganäs introduces 17-4 PH steel powder for its Digital Metal 3D printing technology

Höganäs, Sweden, extends its 3D printing capability by introducing high-performance 17-4 PH stainless steel for its Digital Metal printing technology.

3D-printed metal aircraft parts

Alcoa, Pittsburgh, entered into an agreement with Airbus, France, to supply 3D-printed metal parts for commercial aircraft.

Continuous roller hearth system heat treats aluminum automotive castings

Consolidated Engineering Company (CEC), Kennesaw, Ga., has received a purchase order for a continuous roller hearth T6 system with a water quench and age oven for the heat treatment of cast aluminum knuckles and other automotive castings.

Making lightweight and strong metal

A Missouri University of Science and Technology, Rolla, researcher and his colleagues have created a lightweight but very strong structural metal that could improve energy efficiency in aerospace, automobile, defense, mobile electronics, and biomedical applications.

Foam metal makes airplanes more than meets the eye (with video)

Imagine an aircraft that could alter its wing shape in midflight and, like a pelican, dive into the water before morphing into a submarine.

Metal foam handles heat better than steel

Researchers at North Carolina State University, Raleigh, have found that novel light-weight composite metal foams (CMFs) are significantly more effective at insulating against high heat than the conventional base metals and alloys that they’re made of, such as steel.

Making metal alloys that stand up to hydrogen

New approach to preventing embrittlement could be useful in nuclear reactors.

Solar Manufacturing partners with Refrac Systems for GFQVHP system

Refrac Systems, Chandler, Ariz., has contracted with Solar Manufacturing, Souderton, Pa., and Beckwood Press & Machinery/Triform, Saint Louis, to help design and build a large 100-ton-load gas fan quench vacuum hot press (GFQVHP) system for its aerospace diffusion bonding operation.

Composite foams of steel spheres embedded in aluminum insulate against heat

North Carolina State University, Raleigh, reports that novel lightweight composite metal foams made of materials such as steel spheres embedded in aluminum are more effective at insulating against heat than solid conventional metals such as steel.

Parker Trutec adds fourth AFC-Holcroft universal batch quench furnace

AFC Holcroft, Wixom, Mich., announces that Parker Trutec Inc., Springfield, Ohio, has added a fourth UBQ 36-48-36 universal batch integral quench furnace to an existing line.

Ipsen ships heat treating furnaces for aerospace, automotive, and power applications

Ipsen, Cherry Valley, Ill., recently shipped seven furnaces around the globe for applications in aerospace, automotive, and power-generation.

Norman Noble explains how to process Nitinol to make successful medical implants

Norman Noble, Highland Heights, Ohio, has prepared “Nitinol Implant Design & Manufacturing,” a paper that explains the properties of the alloy and the challenges involved with processing Nitinol to make effective medical implants such as vascular stents, atrial fibrillation devices, and orthopedic anchors.

First 3D printed part flies on U.S. Navy Trident missile

Lockheed Martin, Sunnyvale, Calif., announces that the U.S. Navy’s first 3-D-printed missile component, a part called a connector backshell, made its debut on three Trident II D5 Fleet ballistic missiles.

IBC to supply Beralcast components to semiconductor manufacturer

IBC Advanced Alloys Corp., Vancouver, has signed an agreement with a leading global manufacturer of semiconductor and electronics assembly equipment to be its exclusive supplier of Beralcast beryllium-aluminum cast components.

SSAB electrogalvanized martensitic steel designed for auto structures

SSAB Steel, Sweden, introduces Docol 1500 MZE electrogalvanized martensitic grade high-strength structural steel for automotive applications.

Paulo Products Kansas City Division becomes AS9100 certified

Paulo Products Co., St. Louis, Mo., announces that its Kansas City Division is now AS9100 certified, and joins the Cleveland Division in being both AS9100 certified and Nadcap accredited.

Solar partners with Refrac to build system for superplastic forming/diffusion bonding

Solar Manufacturing, Souderton, Pa., announces that it has contracted with Refrac Systems, Chandler, Ariz., to help design and build a large 100-ton-load gas fan quench vacuum hot press (GFQVHP) system for its aerospace structures diffusion bonding operation.

Jeol Neoscope SEM enables rapid inspection of electronics

Jeol USA, Peabody, Mass., introduces a new benchtop SEM, the JSM-6000Plus, the third generation of the NeoScope, which delivers fast, high-magnification electron microscopy with more functionality than typical benchtop SEMs.

Cadence develops design and analysis solution for wafer-level chip scale packaging

Cadence Design Systems Inc., San Jose, Calif., offers a foundry-proven IC packaging design and analysis solution for advanced fan-out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs.

Imec opens 300mm cleanroom for 7nm and beyond chip scaling

Imec, Belgium, announces the opening of its new 4000-square-meter cleanroom facility dedicated to scaling IC technology beyond 7nm, bringing the total floor space of its semiconductor research cleanrooms to 12,000 square meters.

Taiwan is new global leader in total IC wafer fab capacity

IC Insights, Scottsdale, Ariz., recently released its new “Global Wafer Capacity 2016-2020” report showing that, as of December 2015, Taiwan is now the global leader in wafer capacity with nearly 22% of worldwide IC capacity installed in the country.

Market for GaN and SiC power semiconductors to top $1B in 2020

IHS Inc., Englewood, Colo., reports that the emerging market for silicon carbide and gallium nitride power semiconductors is forecast to pass the $1 billion mark in five years, energized by demand from hybrid and electric vehicles, power supplies, and photovoltaic inverters.

Advanced power amplifiers enable faster data access, better connections

Global Foundries, Santa Clara, Calif., announces advanced radio-frequency silicon solutions for power amplifiers, further expanding the portfolio of silicon-germanium power amplifier technologies designed to enable performance-optimized cellular and Wi-Fi devices.