Cascade Microtech Inc., Beaverton, Ore., has developed the CM300 Probe System, which automates on-wafer device measurements and enhances device and process characterization and modeling by capturing the true electrical performance of devices, thus enabling hands-off productivity.
Continue readingFlexible and reusable AFM probe
JILA, Colorado, researchers engineered a short, flexible, reusable probe for the atomic force microscope (AFM) that enables state-of-the-art precision and stability in picoscale force measurements.
Continue readingShimadzu opens Solution Center at North American headquarters
Shimadzu Scientific Instruments , Columbia, Md., has opened a new 4100-square-foot Solution Center in Columbia.
Continue readingFort Wayne Metals develops high-strength CP Grade 4 titanium medical implant wire
Fort Wayne Metals, Fort Wayne, Ind., introduces 4TiTude, the first medical implant wire to combine the benefits of pure titanium with the strength of Ti-6Al-4V ELI.
Continue readingPredicting new forms of insulating materials
Topological insulators have been of great interest to physicists in recent years because of unusual properties that may provide insights into quantum physics.
Continue readingWichita State acquires full-scale aircraft structural testing systems from MTS for aviation R&D
MTS Systems Corp., Eden Prairie, Minn., has sold an extensive array of state-of-the-art mechanical testing systems to Wichita State University’s National Institute for Aviation Research (NIAR).
Continue readingScanning Microwave Impedance Microscopy for nanoscale mapping of permittivity and conductivity
Asylum Research, Santa Barbara, Calif., an Oxford Instruments company, has developed Scanning Microwave Impedance Microscopy (sMIM).
Continue readingCadence Incisive 13.2 verification platform enables faster performance
Cadence Design Systems Inc., San Jose, Calif., introduces a faster version of the Incisive functional verification platform.
Continue readingInstrument measures silicon wafer thickness and TSV depths prior to grinding
Lasertec U.S.A., San Jose, Calif., introduces the WASAVI Series BGM300. This instrument measures silicon wafer thicknesses and TSV depths prior to back grinding 3D semiconductor devices.
Continue readingNew center for materials research to advance manufacturing and innovation
The National Institute of Standards and Technology (NIST), Gaithersburg, Md., selected a consortium led by Northwestern University, Ill., to establish a new NIST-sponsored center of excellence for advanced materials research.
Continue readingImproved hydrophobic materials boost power plant efficiency
Researchers at Massachusetts Institute of Technology, Cambridge, say they found a way to improve the efficiency of steam condensation—the key to worldwide production of electricity and clean water.
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