Camtek Ltd., Israel, a leading developer and manufacturer of inspection and metrology equipment for the semiconductor industry, has signed a definitive agreement to acquire Visual Layer, a Tel Aviv-based AI company specializing in visual analytics.
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Backblaze, Inc., San Mateo, Calif., published its 2025 Year-End Drive Stats report that analyzes the performance of 344,196 hard drives across 30 models and found the annual failure rate drops to 1.36% across 344,000+ drives and high-capacity models are on the rise as first 26TB drives enter service.
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The Industrial Metrology Business Unit of Nikon Corporation, Japan, has enhanced its long-trusted AutoMeasure software—used for over 30 years with Nikon’s NEXIV video measuring machines—by adding automated edge finding to make precise dimensional measurement programming even more efficient.
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Intertek, UK, a leading Total Quality Assurance provider to industries worldwide, announced the opening of a new Intertek Caleb Brett laboratory in Naples, Italy, strengthening its presence in this important region and addressing a growing demand for reliable, high-quality testing services in crude oil, refined fuels, and emerging biofuels.
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Researchers at the Korea Research Institute of Standards and Science have developed a real-time diagnostic system for semiconductor plasma process parts which is expected to enhance yield, stability, and cost efficiency by preemptively preventing contaminant particles generated from component corrosion.
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Semiconductor test equipment supplier Advantest Corporation, Japan, announced the T5801 Ultra-High-Speed DRAM Test System to support the latest advancements in high-speed memory technologies —including GDDR7, LPDDR6, and DDR6— critical to meeting the growing demands of artificial intelligence, high-performance computing, and edge applications.
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Nikon Corporation, Japan, launched the NEXIV VMF-K Series, a next-generation video measuring system designed to meet the increasing demands of semiconductor and electronic component inspection while significantly improving measurement throughput.
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Ironwood Electronics, Eagan, Minn., is now producing elastomer sockets which include a protective “P” layer that allows for more insertions by protecting the elastomer from erosion and debris build up, extending the life of the elastomers to 200,000 plus insertions.
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HORIBA STEC, Co., Ltd., Japan, released the fully automated thin film inspection system, Xtrology, that combines spectroscopic ellipsometry, Raman spectroscopy, and photoluminescence sensors making it possible to perform important inspections, such as film thickness measurement, defect analysis, and composition analysis of various wafers with a single instrument.
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Materials Analysis Technology Inc., Taiwan, and Swiss SGS Taiwan Ltd. signed a memorandum of understanding with the goal of providing comprehensive ISO 26262 functional safety product certification services, AEC-Q automotive electronic component reliability verification services, and soft error rate assessment and analysis in the automotive semiconductor and electronic component industries in Taiwan.
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Nikon Metrology, Inc., Japan, and Hyundai Motor North America, Fountain Valley, Calif., announced that Hyundai has purchased and installed Nikon’s X-ray computed tomography system in its newly opened $51.4 million Safety Test and Investigation Laboratory in Superior Township, Mich.
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ProteanTecs, Israel, a global leader of deep data analytics for advanced electronics, and ELES, Italy, a worldwide provider of semiconductor device reliability testing solutions, announced their partnership for safety and mission-critical applications.
Continue readingIn a new study, Lam Research Corp., Fremont, Calif., examined the potential for the use of artificial intelligence in process development for chip fabrication and found that a “human first, computer last” approach can reach process engineering targets dramatically faster and at half the cost compared to today’s approach.
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The graph shows the results of fatigue testing of standard round bar 316 stainless steel specimens, in tension-compression cycling (R = –1) The symbols represent different sets of specimens, with nontreated specimens identified by triangles, treated specimens by squares.
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Traditionally, carburization is carried out at high temperature to maximize the solubility and the rate of interstitial solute diffusion.
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One of the principal advantages of these materials is their versatility.
Continue readingThe effect of tempering temperature on hardness and tensile properties of high-alloy steels appears to have the same general form as those of low-alloy steel.
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Because of the use of nitrogen as an alloying element in these stainless steels, chromium nitrides (CrN) may be present on α/α grain boundaries, on γ/α boundaries, and within the α grains. If formed in large quantities and under conditions in which the chromium-depleted areas do not have time to repair themselves during annealing, the presence of CrN may adversely affect corrosion resistance.
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The exposure of duplex stainless steels to temperatures in the range of 1100 to 1850°F can result in the formation of undesirable intermetallic compounds such as σ and χ phases.
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The graph shows the effects of different cooling rates on the toughness properties (un-notched samples) of AISI 420 and nitrogen-alloyed M333 tool steels.
Continue readingAs shown schematically in the graph, high-temperature hardness is made possible only by a very important straightening mechanism: secondary hardening, promoted by the precipitation of fine alloy carbides.
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Austenitizing temperatures for water-hardening tool steels normally vary from 1400 to 1550°F. Higher temperatures are sometimes used for special purposes.
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