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1458 items found
Edax atom probe assist tool speeds specimen preparation
Published: February 22, 2015
Edax Inc., Mahwah, N.J., has launched the Atom Probe Assist, a new tool designed to help users of atom probe tomography systems prepare specimens for faster and more efficient analysis than previously possible.
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Northwestern researchers evaluate silver nanowires for flexible electronics
Published: February 21, 2015
A research team at Northwestern University's McCormick School of Engineering, Evanston, Ill., has investigated the behavior of silver nanowires under cyclic loading to advance the understanding of how they might function in flexible electronics.
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Oxford Instruments to supply failure analysis systems to semiconductor company
Published: February 21, 2015
Oxford Instruments, England, announces that it has signed an agreement with one of the largest semiconductor companies in Europe to supply multiple failure analysis systems.
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Low-cost 50-cm long carbon nanotube composite fibers produced for flexible electronics
Published: February 18, 2015
Researchers from the Department of Materials Science and Engineering, Stanford University, have reportedly collaborated with researchers in China to produce polymer/carbon-nanotube composite fibers with lengths over 50 cm.
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Materion offers high strength copper foils for electronics
Published: February 18, 2015
Materion Performance Alloys, a Materion Corporation business, Mayfield Heights, Ohio, is preparing to meet increased demand for high-strength copper alloy strip products following the recent announcement by Mitsubishi Electric Co. that it will stop production of its copper alloy business effective March 2015.
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Antireflective backside coatings are NIR optimized with no baking
Published: February 18, 2015
Ultra Tec, Santa Ana, Calif., reports that its Arc-lite antireflective (AR) coating system coats package, board, and wafer level devices very rapidly, generally in less than one minute.
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University of Chicago researchers develop compounds to join semiconductors
Published: February 18, 2015
Researchers at the University of Chicago have reportedly developed compounds of cadmium, lead, and bismuth that can be applied as a liquid or paste to join two semiconductors or semiconductor pieces by heating them to several hundred degrees Celsius.
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Optomec partners with Ceradrop to expand printed electronics
Published: February 09, 2015
Optomec, Albuquerque, N.M., has signed an agreement with Ceradrop to be its exclusive representative in France for Aerosol Jet systems used for printing electronics.
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New specimen preparation solution
Published: February 06, 2015
EXpressLO LLC, Lehigh Acres, Fla., released the Aspirato lift out module for the EXpressLO ex situ lift out station.
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Femtosecond lasers make metals superhydrophobic
Published: January 25, 2015
Scientists at the University of Rochester, N.Y., have reportedly transformed platinum, titanium, and brass into superhydrophobic materials with femtosecond laser pulses.
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