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1458 items found
Solar Atmospheres heat treats titanium manifold for Orion spacecraft
Published: January 07, 2015
Solar Atmospheres of Western Pennsylvania, Hermitage, Pa., announces that it vacuum heat-treated the titanium manifold in the Launch Abort System of the NASA Orion spacecraft launched in December.
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Coatings with air-filled aluminum oxide microspheres protect turbines
Published: January 05, 2015
Researchers at Fraunhofer ICT, Germany, have developed a coating in which air-filled aluminum oxide microspheres protect against heat and oxidation.
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Ultra Tec adds improved optics to ASAP-1 IPS for accurate tool positioning
Published: January 03, 2015
Ultra Tec Mfg. Inc., Santa Ana, Calif., announces that an improved machine-vision camera is now shipping with its ASAP-1 IPS units.
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Fine-pitch copper pillar flip chip enables lower cost, green compliance
Published: December 12, 2014
Amkor Copper, Chandler, Ariz., has available a copper pillar bump flip chip interconnect, which offers advantages in many designs while meeting current and future ROHS requirements.
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RF transistors made of films of black phosphorus
Published: December 12, 2014
Researchers at the University of Southern California, Los Angeles, have shown that films of black phosphorus can be used to make radio-frequency transistors, components found in many telecommunication devices.
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CoorsTek to acquire Covalent Materials Corporation
Published: December 12, 2014
CoorsTek Inc., Golden, Colo., has reached a definitive agreement with the Carlyle Group and Unison Capital Group to acquire Covalent Materials Corp., Japan.
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Semiconductor equipment sales to reach nearly $44B in 2015
Published: December 12, 2014
SEMI, San Jose, Calif., projects that worldwide sales of new semiconductor manufacturing equipment will increase 19.3% to $38.0 billion in 2014, according to its year-end forecast.
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Sematech makes progress in EUV-resist outgas testing
Published: December 12, 2014
Sematech, Albany, N.Y., reports that promising progress has been made in qualifying outgassing specifications for extreme ultraviolet (EUV) lithography.
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Mentor Graphics EZ-VIP provides re-usable building blocks to cut testbench assembly time
Published: December 12, 2014
Mentor Graphics Corp., Wilsonville, Ore., announces the immediate availability of its new Mentor EZ-VIP PCI Express Verification IP (VIP).
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Helios PFIB designed for semiconductor failure analysis and process development
Published: December 12, 2014
FEI Corp., Hillsboro, Ore., offers the Helios PFIB for large area deprocessing to enable electrical fault isolation of advanced process ICs, and advanced failure analysis of 3D packages.
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