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1458 items found
Semiconductors are revolutionizing solar power
Published: July 19, 2024
New research at the University of Kansas partially explains the exceptional performance of a new class of organic semiconductors called non-fullerene acceptors.
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Applied Materials unveils chip wiring innovations for more energy-efficient computing
Published: July 18, 2024
Applied Materials, Inc., Santa Clara, Calif., introduced materials engineering innovations designed to increase the performance-per-watt of computer systems by enabling copper wiring to scale to the 2nm logic node and beyond.
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TESCAN GROUP enhances presence in Korean electron microscopy and computed tomography market through merger & acquisition
Published: June 20, 2024
TESCAN GROUP, a.s., Czech Republic, completed its acquisition of TESCAN KOREA, Ltd. and Daeil Microanalysis Laboratory, after two decades of successful collaboration consolidating efforts to better serve the Korean customers and market, particularly in the semiconductor domain.
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inTEST Corporation launches innovative hover sense non-contact probe testing technology for electric vehicle battery testing
Published: June 20, 2024
inTEST Corporation, Mt. Laurel, N. J., launched the Acculogic patent-pending hover sense non-contact technology for electric vehicle battery testing, representing a significant leap forward in validating the quality and reliability of EV battery interconnects.
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ElevATE Semiconductor and GlobalFoundries partner on high-voltage chips for commercial and national security applications
Published: June 20, 2024
ElevATE Semiconductor, San Diego, Calif., and GlobalFoundries (GF) announced a manufacturing partnership for high-voltage chips produced at GF’s facility in Essex Junction, Vermont.
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Chaco metamaterial paves the way for exciting applications in memory storage
Published: June 20, 2024
Scientists at Los Alamos National Laboratory, N. M., and Tel Aviv University, Israel, have achieved a breakthrough in material science with the creation of “Chaco,” a revolutionary metamaterial named after the historical site Chaco Canyon in New Mexico.
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POSTECH researchers maximize the efficiency of hafnia-based ferroelectric memory devices
Published: June 20, 2024
Researchers at Pohang University of Science and Technology, South Korea, have significantly enhanced the data storage capacity of ferroelectric memory devices using hafnia-based ferroelectric materials and an innovative device structure.
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Greener electronics being developed to reduce unsustainably high levels of e-waste
Published: June 20, 2024
To reduce unsustainably high levels of e-waste, an expert in green chemistry at Swedish research institute Research Institutes of Sweden has switched his focus from pulp to wood in a bid to make consumer electronic devices that have no carbon footprint and are easier to recycle.
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Turning up the heat on data storage: New memory device paves the way for AI computing in extreme environments
Published: May 16, 2024
Researchers at University of Pennsylvania demonstrated memory technology capable of enduring temperatures as high as 600° Celsius—more than twice the tolerance of any commercial drives on the market—and these characteristics were maintained for more than 60 hours, indicating exceptional stability and reliability.
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Groundbreaking microcapacitors could power chips of the future
Published: May 16, 2024
Scientists at Lawrence Berkeley National Laboratory, Berkeley, Calif., developed microcapacitors with ultrahigh energy and power density, paving the way for on-chip energy storage in electronic devices.
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