-
1458 items found
Henkel semiconductor capillary underfill enables complex AI and HPC large body advanced packaging designs
Published: April 18, 2024
Henkel, Germany, released a semiconductor capillary underfill encapsulant to address the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications.
News, Magazine & Media / Industry News
Lam Research introduces breakthrough deposition technique to enable next-generation MEMS for 5G and beyond
Published: April 18, 2024
Lam Research Corp., Fremont, Calif., introduced the world’s first production-oriented pulsed laser deposition tool to enable next-generation MEMS-based microphones and radio frequency filters.
News, Magazine & Media / Industry News
Hexagon’s industry-first zoom-enabled optical 3D scanner
Published: April 18, 2024
Hexagon’s Manufacturing Intelligence division, Sweden, launched the first optical 3D scanner on the market with a motorized zoom lens that enables users to adjust data resolution and measurement volume entirely through software settings.
News, Magazine & Media / Industry News
Fraunhofer IWS transfers laser-based sound analysis of surfaces into industrial practice with “LAwave”
Published: April 04, 2024
The Fraunhofer Institute for Material and Beam Technology IWS in Germany is showcasing the second generation of its user-friendly laser-induced surface wave spectroscopy technology, called LAwave, at the “Control” trade fair in April 2024, facilitating the transition of this research-proven technology into industrial applications.
News, Magazine & Media / Industry News
Synopsys to acquire Ansys, creating a leader in silicon to systems design solutions
Published: March 21, 2024
Synopsys, Sunnyvale, Calif., and Ansys, Canonsburg¸Pa., announced that they have entered into a definitive agreement under which Synopsys will acquire Ansys.
News, Magazine & Media / Industry News
TSMC and Synopsys bring breakthrough NVIDIA computational lithography platform to production
Published: March 21, 2024
NVIDIA, Santa Clara, Calif., announced that TSMC, Taiwan, and Synopsys, Sunnyvale, Calif., are going into production with NVIDIA’s computational lithography platform to accelerate manufacturing and push the limits of physics for the next generation of advanced semiconductor chips.
News, Magazine & Media / Industry News
TESCAN Group spearheads innovation with two new premier demo labs in North America
Published: March 21, 2024
Solidifying its presence in the North American market, TESCAN Group, Czech Republic, announced the opening of its two new premier demo labs in Warrendale, Pa., and Phoenix Ariz., marking an important step in expanding its presence across the country.
News, Magazine & Media / Industry News
Suicide chips could boost electronics security
Published: March 21, 2024
Researchers at the University of Vermont developed microchips with a feature that combines anti-counterfeit with a function that causes them to self-destruct if an attempt is made to compromise them.
News, Magazine & Media / Industry News
Material insights enable new, high-speed electronics
Published: March 21, 2024
A new study conducted by researchers from the University of Delaware’s Center for Composite Materials (CCM) and DuPont Specialty Products, Wilmington, Del., now provides insights about a composite material that can be used to make thin, flexible and durable circuit boards.
News, Magazine & Media / Industry News
LLNL scientists advance light-responsive material
Published: March 21, 2024
Researchers at Lawrence Livermore National Laboratory, Livermore, Calif., have furthered a new type of soft material that can change shape in response to light, a discovery that could advance “soft machines” for a variety of fields, from robotics to medicine.
News, Magazine & Media / Industry News
