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1458 items found
Artificial intelligence unravels mysteries of polycrystalline materials
Published: January 18, 2024
Researchers at Nagoya University in Japan used artificial intelligence to discover a new method to understand dislocations in polycrystalline materials, materials widely used in information equipment, solar cells, and electronic devices, that can reduce their efficiency.
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Intel Core Ultra ushers in the Age of the AI PC
Published: January 18, 2024
Intel, Santa Clara, Calif., launched its Intel Core Ultra mobile processors that deliver reimagined power efficiency, world-class compute and graphics performance and the best AI PC experience to mobile platforms and out to the edge.
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Next generation semiconductors: diamond device shows highest breakdown voltage
Published: December 07, 2023
Researchers at the University of Illinois Urbana-Champaign have developed a semiconductor device made using diamond, that has the highest breakdown voltage and lowest leakage current compared to previously reported diamond devices.
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2D material reshapes 3D electronics for AI hardware
Published: December 07, 2023
An international team, including researchers from Washington University in St. Louis, Massachusetts Institute of Technology, Yonsei University and Inha University in Korea, Georgia Institute of Technology, and the University of Notre Dame, has demonstrated the monolithic 3D integration of layered 2D material into novel processing hardware, addressing the challenge of increased information transfer time between functional components in advanced computer chips and paving the way for AI computing.
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USTC achieves chemically controlled reversible magnetic phase transition
Published: December 07, 2023
A research team at the University of Science and Technology of China of the Chinese Academy of Sciences developed a groundbreaking chemical method for two-dimensional metal-organic lattices.
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Onsemi opens state-of-the-art systems application lab for electric vehicles in Europe
Published: December 07, 2023
Onsemi, Scottsdale, Ariz., opened an application test lab in Piestany, Slovakia, focused on the advancement of system solutions for battery/plug-in hybrid/electric vehicles and energy infrastructure power conversion systems.
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Weebit Nano’s ReRAM IP Achieves high temperature qualification in SkyWater Technology’s S130 Process
Published: December 07, 2023
Weebit Nano Limited, Israel, a leading developer of advanced memory technologies for the global semiconductor industry, and SkyWater Technology, Bloomington, Minn., the trusted technology realization partner, announced that Weebit’s Resistive Random-Access Memory IP module has been fully qualified in SkyWater’s 130nm CMOS process at temperatures of up to 125 degrees Celsius – the temperature specified for Grade-1 automotive applications.
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Oxford Instruments launched its Innovation Center
Published: December 07, 2023
Oxford Instruments, England, has brought together the best of its analytical innovations to form the Oxford Instruments Innovation Center, a state-of-the-art facility at its High Wycombe site.
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Thermo Fisher Scientific announces new electron beam fault localization system for analyzing advanced logic semiconductors
Published: November 24, 2023
Thermo Fisher Scientific, Hillsboro, Ore., the world leader in serving science, introduced the Thermo Scientific Meridian EX System— an electron-beam-based failure analysis solution designed to enable precise fault localization on advanced semiconductor logic technologies that helps users localize defects within complex power networks and achieve 10X improvement in spatial resolution compared to optical fault isolation solutions.
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Samsung to unveil 3D AI chip packaging tech SAINT to rival TSMC
Published: November 24, 2023
Samsung Electronics Co., South Korea, the world’s largest memory chipmaker, plans to unveil an advanced three-dimensional chip packaging technology to compete with foundry leader Taiwan Semiconductor Manufacturing Company.
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