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1458 items found
Imec enables tight standard cell boundary scaling using a two-level semi-damascene integration scheme
Published: January 19, 2023
Imec, Belgium, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents a semi-damascene integration approach for implementing the vertical-horizontal-vertical (VHV) scaling booster – intended to enable 4-track (4T) standard cells. The semi-damascene process enables cell boundary scaling down to 8nm tip-to-tip (T2T) in the middle-of-line (MOL) layers, providing self-aligned edges. This provides... View Article
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Applied Materials launches ‘Singapore 2030’ plan to expand its operations and innovation capabilities
Published: January 19, 2023
Applied Materials, Inc., Santa Clara, Calif., announced “Singapore 2030” – a multi-faceted plan to expand its operations in Singapore over the next eight years. The plan is targeted at strengthening the company’s global manufacturing and R&D capabilities, broadening technology ecosystem partnerships in Singapore and promoting local workforce development. “For the past 30 years, Singapore has... View Article
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Blocking radio waves and electromagnetic interference with the flip of a switch
Published: January 19, 2023
Researchers in Drexel University’s College of Engineering have developed a thin film device fabricated by spray coating that can block electromagnetic radiation with the flip of a switch. The breakthrough, enabled by versatile two-dimensional materials called MXenes, could adjust the performance of electronic devices, strengthen wireless connections, and secure mobile communications against intrusion. The team... View Article
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Chipletz selects Siemens’ EDA solutions for its smart substrate IC packaging technology
Published: January 19, 2023
Siemens Digital Industries Software, Plano, Texas, announced that Chipletz, an innovative fabless substrate startup, has selected Siemens as its strategic electronic design automation (EDA) provider for the development of its groundbreaking Smart Substrate products. After an extensive technical evaluation of available solutions, Chipletz selected a suite of Siemens’ industry-leading EDA tools for the design and... View Article
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AI discovers new nanostructures
Published: January 19, 2023
Scientists at the U.S. Department of Energy’s (DOE) Brookhaven National Laboratory, Upton, N.Y., have successfully demonstrated that autonomous methods can discover new materials. The artificial intelligence (AI)-driven technique led to the discovery of three new nanostructures, including a first-of-its-kind nanoscale “ladder.” The research was published in Science Advances. The newly discovered structures were formed by... View Article
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Nanoscience Instruments announces partnership with Ivium Technologies
Published: December 08, 2022
Nanoscience Instruments, Phoenix, has strategically partnered with Ivium Technologies, a Dutch manufacturer of advanced potentiostats/galvanostats and battery cycling instrumentation to distribute their products across the United States and Canada.
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A novel concept for photovoltaics that exploits the ability of materials to exist in different crystalline phases
Published: December 08, 2022
Researchers at the Integrated Center for Physics and Photonic Materials and the Center for Advancing Electronics Dresden at Technische Universität Dresden, Germany, have demonstrated a novel concept for solar cells that exploits the ability of materials to exist in different crystalline phases.
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Researchers develop novel monolithic integrated micro-supercapacitors
Published: December 08, 2022
Researchers at the Dalian Institute of Chemical Physics of the Chinese Academy of Sciences, Shenzhen Institute of Advanced Technology, and the Institute of Metal Research of CAS, have developed monolithic integrated micro-supercapacitors with ultrahigh systemic volumetric performance and areal output voltages.
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Advantest unveils E5620 DR-SEM for review and classification of ultra-small photomask defects
Published: December 08, 2022
Advantest Corp., Japan, unveiled the E5620 Defect Review Scanning Electron Microscope, its newest mask SEM product for reviewing and classifying ultra-small defects on photomasks and mask blanks.
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Electrically isolating epoxy features ultra-high heat transfer capability
Published: December 08, 2022
Master Bond, Hackensack, N.J., released EP5TC-80, a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m•K), while also retaining its electrical non-conductivity.
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