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1458 items found
Improving optoelectronic performance with bandgap engineering
Published: September 13, 2021
Research from King Abdullah University of Science and Technology, Saudi Arabia, shows that bandgap engineering can improve the performance of optoelectronic devices that aim to harness the energy of "hot" electrons.
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Fully pressure-insensitive, pressure-based, mass flow controller for etch and CVD processes in semiconductor manufacturing
Published: September 13, 2021
Brooks Instrument, a leader in precision fluid measurement and control technology, has released the new GP200 Series, the first fully pressure-insensitive, pressure-based, mass flow controller designed specifically for etch and chemical vapor deposition processes in semiconductor manufacturing.
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Tescan announces large volume workflow to improve time-to-result and increase throughput for plasma FIB sample processing
Published: September 13, 2021
The new Large Volume Workflow from Tescan Orsay Holding, Czechia, harnesses the natural synergies of plasma FIB-SEM and a stand-alone laser tool to support rapid, cubic-millimeter-scale material removal for sample preparation and further analysis.
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Understanding silicon failures opens research path for higher-capacity lithium-ion batteries
Published: August 19, 2021
Research with nanowires at Los Alamos National Laboratory, N.M., reveals an electrolyte’s role in blocking electrical current inside anodes and suggests coating might solve the problem, opening fresh avenues for harnessing the potential for silicon to revolutionize high-capacity, long-lasting batteries for everything from cell phones to automobiles.
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Atomica announces new brand, $50 million equipment acquisition
Published: August 19, 2021
Atomica, Santa Barbara, Calif., formerly known as Innovative Micro Technology Inc., a global leader in microelectromechanical systems, has acquired $50 million of cutting-edge semiconductor processing tools.
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Submerged sensors to control wearable electronics
Published: August 19, 2021
Researchers based at Soongsil University in Korea developed flexible and waterproof sensors that could unlock new applications for wearable electronics, transforming their use in healthcare, smart textiles, and for applications including scuba diving equipment.
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Hitachi High-Tech launches the AFM100 and AFM100 Plus atomic force microscopes
Published: August 19, 2021
Hitachi High-Tech Corporation, Japan, announced the launch of its AFM100 and AFM100 Plus systems – entry-level and intermediate-level models of Hitachi’s compact and versatile atomic force microscopes.
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Picosun delivers ALD technology for volume manufacturing of optical semiconductor devices
Published: August 19, 2021
Picosun Group, Finland, delivers cutting-edge atomic layer deposition technology for volume manufacturing of optical semiconductor devices.
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An energy-efficient way of enriching hydrogen isotopes in silicon
Published: August 19, 2021
A team of scientists at Nagoya City University, Japan, in collaboration with the Japan Atomic Energy Agency and Kyoto University, have found an energy-efficient strategy to enrich silicon surfaces using a dilute deuterium solution.
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Development of a Residual Stress Standard
Published: August 19, 2021
In the past ten to fifteen years, significant progress toward the understanding and management of residual stresses in metallic structure has been made under the auspices of numerous Metals Affordability Initiative (MAI) projects, Small Business Innovative Research (SBIR) projects, USAF program funded projects, and many others. In January 2020, the ASM International Technical Committee on Residual Stress formed a subcommittee on residual stress standards development, whose goal is to promote the development of standards and specifications for the measurement, modeling, understanding and management of residual stress
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