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1458 items found
University of Minnesota study opens up possibilities for new transparent materials that conduct electricity
Published: January 24, 2021
Researchers at the University of Minnesota, Minneapolis, were able to isolate and image the structure and composition of the metallic line defect in a perovskite crystal BaSnO3.
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Semiconductor Industry Association applauds NDAA enactment, urges full funding for semiconductor manufacturing and research provisions
Published: January 24, 2021
The Semiconductor Industry Association (SIA), Washington, D.C., applauded Congress for enacting the National Defense Authorization Act (NDAA) legislation that includes Title XCIX, “Creating Helpful Incentives to Produce Semiconductors for America,” which authorizes federal incentives to promote semiconductor manufacturing and federal investments in semiconductor research.
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Ambiq Wins “IoT Semiconductor Company of the Year” award in 2021 IoT Breakthrough Awards Program
Published: January 24, 2021
Ambiq, Austin, TX, a technology leader recognized in ultra-low power microcontrollers (MCU), System-on-Chips (SoC), and Real-time Clocks (RTC), has been selected as the winner of the “IoT Semiconductor Company of the Year” by the IoT Breakthrough Awards.
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Park Systems selected for Forbes Asia’s Best Under a Billion list for 2020
Published: January 24, 2021
Park Systems, Suwon, Korea, was selected this year for Forbes Asia’s Best Under A Billion list spotlighting 200 top performing publicly listed companies in the Asia-Pacific region with sales under $1 billion.
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Stanford researchers combine processors and memory on multiple hybrid chips to run AI on battery-powered smart devices
Published: January 24, 2021
A team at Stanford University, Palo Alto, Calif., has designed a system that can run AI tasks faster and with less energy by harnessing eight hybrid chips, each with its own data processor built right next to its own memory storage.
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Markforged unveils new high-strength AM material Onyx ESD for the electronics manufacturing industry
Published: January 24, 2021
Markforged, Watertown, Mass., creator of the world’s largest metal and carbon fiber industrial 3D printing platform, the Digital Forge, recently unveiled Onyx ESD – a new high-strength composite material for the electronics manufacturing industry.
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ASM International Publishes Digital-First Articles from Failure Analysis and Prevention Handbook
Published: December 15, 2020
ASM International publishes digital-first articles from the new edition of Failure Analysis and Prevention Handbook.
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International Symposium for Testing and Failure Analysis Conference Proceedings Added to ASM Digital Library
Published: December 10, 2020
The Electronic Device Failure Analysis Society (EDFAS), an affiliate society of ASM International, is proud to announce the launch of the new ISTFA Proceedings site in the ASM Digital Library. The new site provides convenient access to conference papers from the renowned International Symposium for Testing and Failure Analysis annual event.
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Nikon Metrology and NSI Microscopy Inspection Automation form new partnership
Published: December 09, 2020
Nikon Metrology, Brighton, Mich., announced a new partnership with NSI Microscopy Inspection Automation of Wexford, Ireland.
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A new platform for exploring blended materials along compositional gradients
Published: December 09, 2020
A team from the U.S. Department of Energy’s Brookhaven National Laboratory (Upton, NY), Yale University (New Haven, CT), and University of Pennsylvania (Philadelphia, PA), built a first-of-its-kind automated electrospray deposition tool for depositing films with finely controlled blend compositions made of up to three components onto single samples.
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