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1458 items found
J.A. Woollam and Linkam Scientific bring precise temperature control to its ellipsometry instruments
Published: October 16, 2020
J.A. Woollam, Lincoln, Neb., has worked closely with Linkam Scientific, Surrey, U.K., to bring precise temperature control to its custom ellipsometry instruments.
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Bruker releases new suite of benchtop 3D optical profiler systems
Published: October 05, 2020
Bruker Nano Surfaces announces the release of its next-generation benchtop ContourX 3D optical profilometers for gage-capable surface texture and roughness metrology in R&D and manufacturing environments.
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Zeiss Group segments Carl Zeiss Meditec and Zeiss SMT nominated for innovation award
Published: September 25, 2020
The Zeiss Group, Germany, announces that two Zeiss teams have been nominated for the Deutscher Zukunftspreis – the Federal President's Award for Innovation in Science and Technology, the first time that two segments of the same company have been nominated.
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ON Semiconductor applies electro-optical probing for topside die failure analysis
Published: September 21, 2020
Engineers from ON Semiconductor presented a discussion of the electro-optical probing technique for failure analysis at the wafer and die level, at the ASM International ISTFA 2019 conference in Portland, Oregon.
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Thermo Fisher FA technique uses SEM to probe electrical waveforms on FinFET transistors
Published: September 21, 2020
Engineers from Thermo Fisher Scientific presented a discussion of a technique in which the voltage-contrast mechanism of a scanning electron microscope is used to probe electrical waveforms on FinFET transistors that are located within active integrated circuits.
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Global Foundries and Mentor evaluate net tracing solutions for hotspot analysis
Published: September 21, 2020
Engineers from Global Foundries and Mentor presented a discussion of “Automated Multi-level Circuit Net Trace for Hotspot Analysis” at the ASM International ISTFA 2019 conference in Portland, Oregon.
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Shimadzu and Horiba to combine Raman spectrometer with liquid chromatograph
Published: September 20, 2020
Shimadzu Corp. and Horiba Ltd., both of Japan, have concluded a basic agreement to commence collaboration on the development and sales of LC-Raman analytical and measuring instruments that combine Shimadzu’s high-performance liquid chromatographs (HPLCs, hereinafter LCs) with Horiba’s Raman spectrometers.
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Zeiss improves semiconductor package failure analysis via Advanced Recon Toolbox
Published: September 20, 2020
Zeiss, Pleasanton, Calif., introduces the Advanced Reconstruction Toolbox for its industry-leading Xradia Versa series of non-destructive 3D X-ray microscopes and its Xradia Context 3D X-ray micro-computed tomography (microCT) systems.
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SIA study shows federal incentives would increase chip production facilities in America
Published: September 20, 2020
The Semiconductor Industry Association (SIA), Washington, in partnership with the Boston Consulting Group, has released a study showing that nineteen new chip manufacturing facilities would be built in the United States over the next ten years with a $50 billion federal investment.
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Global Foundries to launch virtual Global Technology Conferences 2020
Published: September 20, 2020
Global Foundries, Santa Clara, Calif., announces that it will launch its Global Technology Conferences (GTC) 2020 series virtually with their first event, GTC North America, on September 24.
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