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1458 items found
Materion provides AlBeMet and SupremEX composites for EU Copernicus satellites
Published: December 05, 2019
Materion Corp., Mayfield Heights, Ohio, and Synopta GmbH, Switzerland, announce the successful completion of the latest satellite as part of the Copernicus Earth observation project—a European initiative that monitors the changing conditions and general heath of the planet.
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Zeiss innovations improve accuracy of 3D tomography, speed FIB-SEM sample preparation
Published: December 05, 2019
Zeiss Microcopy, Germany, announces new extensions on Zeiss Crossbeam 350/550 and Zeiss Atlas 5 that enable faster accessibility to deeper regions of interest when investigating material samples in three dimensions.
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Siemens digital enterprise software to accelerate Oerlikon AM additive manufacturing
Published: November 21, 2019
Oerlikon AM, Charlotte, N.C., and Siemens AG, Germany, announce a strategic agreement in which Siemens will provide Oerlikon AM with digital enterprise solutions that will help Oerlikon accelerate the industrialization of additive manufacturing.
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GE Additive Arcam EBM launches D-material support for copper and tool steel powders
Published: November 21, 2019
GE Additive Arcam, Frankfurt, Germany, announces that development material (D-material) support for pure copper and highly alloyed tool steel powders will be available beginning in 2020.
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Exponent shows stainless steel resists general corrosion, but is susceptible to other types
Published: November 15, 2019
Engineers from Exponent, Menlo Park, Calif., explained in a presentation at MS&T 2019 that although stainless steel is resistant to general corrosion, the failure analysis of a stainless steel hot water heater shows that it is susceptible to other modes of corrosion.
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Rapid analyses of cracks via EBSD and EDS aid understanding of crack formation
Published: November 15, 2019
Researchers from Oxford Instruments and Manchester University reported at MS&T 2019 in Portland that rapid analyses of cracks via EBSD and EDS enable a comprehensive understanding of the dynamics of crack formation and subsequent propagation.
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Failure analysis shows how design errors contributed to collapse of 1350-foot tower
Published: November 15, 2019
George Vander Voort of Vander Voort Consulting, presented a discussion of a tower design that ignored dynamic stresses, leading to the collapse of a radio tower.
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Single-step sample-prep method protects fragile silicon-integrated photonics modules
Published: October 21, 2019
Engineers from GlobalFoundries, Malta, N.Y., will present a discussion at ISTFA 2019 of a new single-step method of sample preparation for fragile modules.
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Wafer-level failure analysis combines acoustic microscopy with atomic force microscopy
Published: October 21, 2019
Engineers from Imec, the Fraunhofer Institute, and Tepla Analytical Systems will present a discussion at ISTFA 2019 of a wafer-level failure analysis method in which scanning acoustic microscopy is combined with atomic force microscopy methods.
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X-ray microscopic chemical imaging enables rapid failure analysis of semiconductors
Published: October 21, 2019
Researchers from Sigray Inc., Concord, Calif., will discuss at ISTFA 2019 that new heterogeneous integration schemes and continuing miniaturization of packaging components such as micropillars are driving demand for new substantive changes to conventional failure analysis.
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