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1458 items found
Thermo Scientific Apreo SEM for materials science features compound lens design
Published: May 24, 2018
Thermo Scientific, Hillsboro, Oregon, has developed the Apreo scanning electron microscope, which features a revolutionary compound lens design that combines electrostatic and magnetic immersion technology to yield unprecedented resolution and signal selection.
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Zeiss Zen Connect software for microscopes enables imaging all dimensions of a sample
Published: May 24, 2018
Carl Zeiss, Germany, introduces Zen Connect, new software modules with enhanced imaging technology that is especially useful for structural analysis.
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Oxford Instruments’ Layerprobe software tool designed for thin film analysis
Published: May 22, 2018
Oxford Instruments, U.K., offers LayerProbe, a software tool for thin film analysis in the SEM that is said to be faster and more cost-effective, with higher resolution than dedicated thin film measurement tools.
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Semtech acquires IC Interconnect to strengthen R&D for next-gen protection platforms
Published: May 21, 2018
Semtech Corp., Camarillo, Calif., has acquired substantially all the assets of IC Interconnect Inc., Colorado Springs, Colo., which provides contract wafer bumping and related services to the electronics industry.
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Adesto Tech acquires S3 Semiconductors to expand its portfolio of technologies
Published: May 21, 2018
Adesto Technologies, Santa Clara, Calif., a provider of innovative application-specific semiconductors for the IoT era, announces that it has acquired Dublin-based S3 Semiconductors, a global supplier of mixed-signal and RF application specific integrated circuits (ASIC) and an extensive library of design IP.
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Global semiconductor sales up 20% year-over-year in first quarter of 2018
Published: May 21, 2018
The Semiconductor Industry Association, Washington, announces that worldwide sales of semiconductors reached $111.1 billion during the first quarter of 2018, an increase of 20 percent compared to the first quarter of 2017, but 2.5 percent less than the fourth quarter of 2017.
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Cohu to acquire Xcerra for its back-end semiconductor test and inspection equipment
Published: May 21, 2018
Cohu Inc., Poway, Calif., and Xcerra Corp., Norwood, Mass., have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock.
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EV Group to expand manufacturing facility for wafer bonding, lithography equipment
Published: May 21, 2018
EV Group, Austria, has started construction work for its Manufacturing III facility, the next expansion phase of its corporate headquarters.
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Burloak Technologies to invest $81.5 million in additive manufacturing center in Ontario
Published: May 20, 2018
Burloak Technologies, a division of Samuel, Son & Co., Dundas, Ontario, is investing a total of $81.5 million in a new Additive Manufacturing Technology Center in Oakville, Ontario.
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Leica Center of Excellence in microscopy launched at California NanoSystems Institute
Published: May 20, 2018
The University of California at Los Angeles, in collaboration with Leica Microsystems Inc., Germany, has established the Leica Center of Excellence at UCLA to fast-track the commercial development of new optical microscopy tools and methods.
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