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1458 items found
Micron and Intel announce update to NAND memory joint development program
Published: January 22, 2018
Micron, San Jose, Calif., and Intel, Santa Clara,Calif., announce an update to their successful NAND joint development partnership that has helped the companies develop and deliver industry-leading NAND technologies to market.
News, Magazine & Media / Industry News
SEMI and Fab Owners Association strengthen supply chain
Published: January 22, 2018
After several years of close partnership, SEMI, Milpitas, Calif., and the Fab Owners Association (FOA), Cupertino, Calif., have fully integrated.
News, Magazine & Media / Industry News
Nordson acquires Sonoscan for analysis of electronic devices by acoustic micro-imaging
Published: January 14, 2018
Nordson Corp., Westlake, Ohio, has acquired Sonoscan Inc., Elk Grove Village, Illinois, a designer and manufacturer of acoustic microscopes and sophisticated acoustic micro-imaging systems used in a variety of microelectronic, automotive, aerospace, and industrial electronics assembly applications.
News, Magazine & Media / Industry News
Global Foundries, Ayar Labs collaborate for ten times higher bandwidth
Published: December 18, 2017
Global Foundries, Santa Clara, Calif., and Ayar Labs, Emeryville, Calif., a startup bringing optical input/output (I/O) to silicon chips, announce a strategic collaboration to co-develop and commercialize differentiated silicon photonic technology solutions.
News, Magazine & Media / Industry News
$55.9B semiconductor equipment forecast: New record with Korea at the top
Published: December 18, 2017
SEMI, Milpitas, Calif., the global industry association representing the electronics manufacturing supply chain, has released its Year-End Forecast.
News, Magazine & Media / Industry News
Soitec announces substrate breakthrough for 3D image sensing devices
Published: December 18, 2017
Soitec, France, announces the latest generation of silicon-on-insulator substrates in its Imager-SOI product line, which is designed specifically for fabricating front-side imagers for near-infrared (NIR) applications, including advanced 3D image sensors.
News, Magazine & Media / Industry News
GlobalFoundries, Ayar Labs collaborate to develop ten times higher bandwidth
Published: December 18, 2017
GlobalFoundries and Ayar Labs, a startup bringing optical input/output (I/O) to silicon chips, announce a strategic collaboration to co-develop and commercialize differentiated silicon photonic technology solutions.
News, Magazine & Media / Industry News
ProPlus and MPI establish strategic partnership to integrate and optimize technologies
Published: December 18, 2017
ProPlus Design Solutions Inc., San Jose, Calif., and MPI Corp., Taiwan, announce a strategic partnership agreement and immediate availability of a characterization and modeling solution that integrates the ProPlus Spice modeling and noise characterization solution with MPI’s advanced probing technologies.
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CVD buys 180,000 sq. ft. facility to manufacture composites and electronic materials
Published: December 18, 2017
CVD Equipment Corp., Ronkonkoma, N.Y., a provider of chemical vapor deposition systems and materials, announces that it has completed the purchase of the company’s planned additional facility in Central Islip, New York.
News, Magazine & Media / Industry News
Invensas completes direct bond technology transfer to Teledyne DALSA
Published: December 18, 2017
Invensas, San Jose, Calif., a wholly owned subsidiary of Xperi Corp., announces the successful technology transfer of its Direct Bond Interconnect to Teledyne DALSA, a Teledyne Technologies company.
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