Jeol e-beam lithography system to write high-resolution circuitry patterns for nanofab

Published: May 26, 2015

Jeol USA, Peabody, Mass., announces that a state-of-the-art Jeol e-beam lithography system will soon be installed at the University of Waterloo Quantum NanoFab in Waterloo, Ontario.

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High-vacuum SSRM AFM system designed for semiconductor failure analysis

Published: May 26, 2015

Park Systems, Santa Clara, Calif., introduces the NX-Hivac AFM system for semiconductor failure analysis.

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Silver sinter paste for power semiconductors has strong adhesion to copper

Published: May 26, 2015

Kyocera America Inc., San Diego, announces the U.S. introduction of its XT2773R7 Silver Sinter Paste, a proprietary formulation specifically developed to deliver higher performance than high-lead solders.

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Titanium nitride hardmask system enables patterning copper interconnects at 10 nm

Published: May 25, 2015

Applied Materials Inc., Santa Clara, Calif., introduces the Applied Endura Cirrus HTX PVD titanium nitride hardmask system with advanced technology for patterning copper interconnects at 10 nm and beyond.

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Electroless deposition of cobalt enables void-free filling of vias for electronic chips

Published: May 25, 2015

Imec, Belgium, and Lam Research Corp., Fremont, Calif., have reportedly developed a novel bottom-up cobalt prefill technique for vias and contacts for electronic chips.

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Laser-induced thermal cracking speeds production of silicon chips

Published: May 25, 2015

The Agency for Science, Technology, and Research (A-Star), Singapore, reports that a laser-induced thermal cracking technology for cutting silicon wafers could streamline the production of smaller and more powerful microchips for electronic devices.

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Magnesium printed circuits designed to self-destruct on command

Published: May 25, 2015

Researchers at the University of Illinois, Champaign, have reportedly developed heat-triggered self-destructing electronic devices.

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Sematech and Exogenesis form alliance for accelerated neutral atom beam technology

Published: May 25, 2015

Sematech, Albany, N.Y., and Exogenesis Corp., Billerica, Mass., have agreed to a strategic alliance to commercialize the Exogenesis Accelerated Neutral Atom Beam (ANAB) process technology and the nAccel accelerated particle beam equipment platform.

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Program focuses on future materials scientists

Published: May 21, 2015

With advances in science and technology, today's high school students could end up working with materials that don't even exist today.

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MS&T2016—Call for symposium proposals

Published: May 15, 2015

Symposium proposals for MS&T16 are being accepted through May 31, 2015.

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