New hybrid techniques for backside thinning and polishing improve device uniformity

Published: June 19, 2015

Ultra Tec Manufacturing, Santa Ana, Calif., has developed new hybrid 3D backside thinning and polishing techniques for the achievement of extremely uniform remaining silicon thickness.

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Bruker microscope integrates imaging with 3D optical metrology

Published: June 19, 2015

Bruker Corp., Billerica, Mass., has released its new Contour Elite 3D Optical Microscopes, which for the first time fully integrate high-definition microscopy imaging with industry-leading three-dimensional optical metrology functionality.

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DualBeam PFIB enables failure analysis on semiconductors smaller than 20 nm

Published: June 19, 2015

FEI, Hillsboro, Ore., introduces the DualBeam plasma-focused ion beam (PFIB) for sample preparation, electrical fault isolation, and electrical failure analysis on sub-20nm semiconductor devices.

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DCG Systems acquires MultiProbe for its atomic force probe technology

Published: June 19, 2015

DCG Systems, Fremont, Calif., has acquired the assets of MultiProbe, the leading provider of atomic force-based nanoprobe solutions for the semiconductor industry.

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Graphene coated copper wire could boost chip speeds by up to 30%

Published: June 19, 2015

Researchers from Stanford University, Stanford, Calif., report that they have developed graphene sheathing material for the copper wires in computer chips.

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Transparent stretchable conductors based on nano-accordion structure

Published: June 19, 2015

Researchers from North Carolina State University, Raleigh, report that they have fabricated stretchable transparent conductors that work because of their "nano-accordion" design.

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Flexible polymer electrodes printed with improved electrical properties

Published: June 19, 2015

The Technical University of Munich (TUM) announces that its researchers have printed razor-thin polymer electrodes with improved electrical properties.

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Conferences convene for successful Mega Show event

Published: May 28, 2015

Aerospace and thermal spray professionals gathered for aerospace coating and materials information.

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Winners of Materials Genome Toolkit competition announced

Published: May 27, 2015

ASM International's CMD Network is pleased to announce the winners of the 2015 ASM Materials Genome Toolkit competition.

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Helios NanoLab combines high-resolution SEM and FIB with precision deposition

Published: May 26, 2015

FEI Co., Hillsboro, Ore., offers the Helios NanoLab 460F1, which combines the highest resolution scanning electron microscope (Elstar+UC SEM) and focused ion beam (Tomahawk FIB) columns on the market today with the most advanced sample manipulation capabilities.

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