Two-dimensional phosphorus provides stable semiconductor properties

Published: September 22, 2014

Researchers at Rice University, Houston, Texas, report that semiconducting phosphorus sheets do not contain the rows of defects that reduce the electronic properties of other materials.

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Intel releases new high-density modular test platform

Published: September 22, 2014

Intel Corp., Santa Clara, Calif., has announced the availability of its revolutionary high-density modular test (HDMT) platform.

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Veeco IBD upgrade of Nexus lithography system produces no deposition defects greater than 70 nm

Published: September 22, 2014

Veeco Instruments Inc., Plainview, N.Y., reports that its new Odyssey ion beam deposition (IBD) upgrade for the NEXUS IBD-LDD system has repeatedly produced photomask blanks with zero deposition defects larger than 70 nanometers.

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Germanium-tin thin films deposited on silicon could build better infrared cameras

Published: September 22, 2014

Engineering researchers at the University of Arkansas in Fayetteville have developed an infrared detector made of thin films of GeSn semiconductor material deposited on a silicon substrate.

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FEI opens new technology center in the Czech Republic

Published: September 22, 2014

FEI Co., Hillsboro, Ore., announces the opening of a new technology center in the industrial estate of Cernovická Terasa, Brno, Czech Republic.

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Nordson DAGE Launches automated X-ray inspection system

Published: September 22, 2014

Nordson DAGE, Aylsworth, U.K., a division of Nordson Corp., announces the launch of its Xi3400 Automated X-ray Inspection System (AXI).

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A-STAR forms four semiconductor R&D labs with ten partners

Published: September 22, 2014

A-STAR, Singapore, announces that four joint laboratories, representing a commitment of $160 million between private and public sectors, were launched this summer between the Agency for Science, Technology and Research's (A*STAR's) Institute of Microelectronics, and its ten industry partners.

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Advantech and Penn State collaborate to simplify fabrication of complex electronic devices

Published: September 22, 2014

Advantech US Inc., Pittsburgh, reports that its engineers working with Penn State's Nanofabrication Laboratory have fabricated a prototype mask of silicon etched with the required micrometer-scale features.

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FEI’s third-generation Helios DualBeam FIB/SEM adds workflow-specific configuration

Published: September 22, 2014

FEI Co., Hillsboro, Ore., has released the third generation of its Helios NanoLab DualBeam FIB/SEM microscope, which provides excellent image contrast and resolution, while at the same time adding a an easy-to-use user interface.

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University of Bristol to install UHV photo electron emission microscopy system

Published: September 22, 2014

The University of Bristol, England, announces that an Ultra High Vacuum (UHV) Photo Electron Emission Microscopy (PEEM) system with state-of-the-art resolution for real-space and momentum-space imaging and spectroscopy will be installed at the University.

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