SUSS MicroTec qualifies its new-generation projection lithography system

Published: June 23, 2014

SUSS MicroTec, Germany, has successfully qualified its new DSC300 Gen2 projection lithography system for volume production at a major Asian packaging house.

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High-performance MoS2 FETs made via unique doping process

Published: June 23, 2014

Semiconductor Research Corp., Research Triangle Park, N.C., reports that a team of researchers from Purdue University, Lafayette, Ind.; SEMATECH, Albany, N.Y.; and SUNY College of Nanoscale Science and Engineering, Albany, N.Y., are working on high-performance molybdenum disulfide field-effect transistors.

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Entegris opens Advanced Materials Science facility in Bedford

Published: June 23, 2014

Entegris Inc., Billerica, Mass., has inaugurated its new i2M Center for Advanced Materials Science in Bedford, Mass.

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Circuits on silicon-carbide wafer can function at 660°F

Published: June 23, 2014

Engineering researchers at the University of Arkansas, Fayetteville, have designed integrated circuits on silicon–carbide wafers that can survive at temperatures greater than 660°F (350°C).

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Mask blank inspection system designed for technology nodes of 14nm through 7nm

Published: June 23, 2014

Lasertec Corp., San Jose, Calif., introduces MAGICS series M8350/M8351, a new line of mask blank inspection systems that meet the requirement of next-generation semiconductor photomasks at the technology nodes of 14nm through 7nm.

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III-V metal-oxide semiconductor FET performance exceeds silicon

Published: June 23, 2014

Researchers from the University of California, Santa Barbara (UCSB), report that they have developed the highest-performing III-V metal-oxide semiconductor (MOS) field-effect transistors.

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Fab equipment spending to increase by 24% in 2014

Published: June 23, 2014

Semiconductor Equipment Manufacturing Industries (SEMI), San Jose, Calif., reports that after two years of decline, fab equipment spending for Front End facilities in 2014 is expected to increase by 24% in 2014 (US$35.7 billion).

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Infrared-based troubleshooting system detects temperature distribution over a circuit board

Published: June 23, 2014

Optotherm, Sewickley, Pa., has developed the EL troubleshooting system, which provides an alternative method of fault detection based on detection of infrared radiation.

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Cadence and Intel collaborate on 14nm Tri-gate design platform for Intel Custom Foundry

Published: June 23, 2014

Cadence Design Systems Inc., San Jose, Calif., and Intel Corp., Santa Clara, Calif., announce that they are collaborating to support Intel's 14nm Tri-Gate process technology for customers of Intel Custom Foundry, which has developed an extensive design platform on Intel's 22nm and 14nm Tri-gate process technology.

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Nikon 750kV microfocus x-ray source enables NDT inspection of steel parts

Published: June 01, 2014

Nikon Metrology Inc., Brighton, Mich., announces a unique 750 kV x-ray source with micron level spot size.

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