Seco-Warwick supplies three vacuum furnaces to Corpus Christi Army Depot in Texas

Published: May 19, 2014

Seco-Warwick, Meadville, Pa., reports that Corpus Christi Army Depot in Texas has purchased three of its vacuum furnaces for vacuum heat treatment of aircraft components.

News, Magazine & Media / Industry News

Mentor Graphics acquires Berkeley Design Automation for its nanometer circuit design expertise

Published: May 19, 2014

Mentor Graphics Corp., Wilsonville, Ore., has acquired Berkeley Design Automation Inc. (BDA), a recognized leader in nanometer analog, mixed-signal, and RF circuit verification.

News, Magazine & Media / Industry News

Global Foundries semiconductor manufacturing platform designed for automotive industry

Published: May 19, 2014

Global Foundries, Santa Clara, Calif., introduces an optimized semiconductor manufacturing platform aimed specifically at meeting the stringent and evolving needs of the automotive industry.

News, Magazine & Media / Industry News

Peregrine Semiconductor ships first UltraCMOS 10 RF switrch production units

Published: May 19, 2014

Peregrine Semiconductor Corp., San Diego, has shipped the first RF switches built on the UltraCMOS 10 technology platform.

News, Magazine & Media / Industry News

Indium SACm solder paste increases device drop-shock resistance by 800%

Published: May 19, 2014

Indium Corp., Utica, N.Y., has developed SACm, a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling.

News, Magazine & Media / Industry News

Applied Materials tool encapsulates copper interconnects in cobalt films

Published: May 19, 2014

Applied Materials Inc., has developed its Applied Endura Volta CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films.

News, Magazine & Media / Industry News

Georgia Tech PRC and Finetech demonstrate copper Interconnects without solder

Published: May 19, 2014

Finetech, Gilbert, Ariz., has been selected by the Georgia Tech Packaging Research Center (PRC), Atlanta, to provide its semi-automatic Matrix bonder to demonstrate the first manufacturable, low-temperature, ultra-fine-pitch copper interconnect and assembly technology.

News, Magazine & Media / Industry News

Sematech achieves zero defects per mask at 100 nm sensitivity in deposited EUV multilayers

Published: May 19, 2014

Sematech, Albany, N.Y., announces that its researchers have reached a significant milestone in reducing to zero the defects generated by tools from the multi-layer deposition of mask blanks for extreme ultraviolet lithography.

News, Magazine & Media / Industry News

Wafer probe system measures device electrical functioning over wide temperature range

Published: May 19, 2014

Cascade Microtech Inc., Beaverton, Ore., has developed the CM300 Probe System, which automates on-wafer device measurements and enhances device and process characterization and modeling by capturing the true electrical performance of devices, thus enabling hands-off productivity.

News, Magazine & Media / Industry News

Bruker’s Vertex FTIR spectrometer covers complete mid and far infrared/THz ranges in one step

Published: May 19, 2014

Bruker Corp., Madison, Wis., announces the world's first FTIR spectrometer that covers the complete mid and far Infrared/THz spectral ranges in one step with no gaps.

News, Magazine & Media / Industry News