FEI Helios NanloLab 600i enables ultrathin samples for TEM

Published: April 21, 2014

FEI Corp., Hillsboro, Oregon, has developed the Helios NanoLab 600i, which offers advances in the ion beam, electron beam, patterning, and a range of other for advanced nanoscale materials research.

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Lockheed Martin opens materials and thermal sciences R&D lab in Palo Alto

Published: March 26, 2014

The Lockheed Martin Space Systems Advanced Technology Center, Palo Alto, has opened an Advanced Materials & Thermal Sciences Center for research and development.

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High-resolution array ICP-OES enables flexibility and high-precision measurement of trace elements

Published: March 24, 2014

Analytik Jena AG, Germany, introduces the PlasmaQuant PQ 9000, its first High-Resolution Array ICP OES (optical emission spectrometry using inductively coupled plasma) for multiple element analysis.

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Ultrasonic phased array produces high-resolution 3D images

Published: March 24, 2014

Researchers at the Fraunhofer Institute for Nondestructive Testing IZFP, Germany, have developed an ultrasonic phased-array instrument that enables them to produce high-resolution 3D images.

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Zeiss 340 and 540 FIB-SEMs feature high-speed processing observed in real time

Published: March 24, 2014

Carl Zeiss Microscopy, Peabody, Mass., introduces the first system of the new Crossbeam 340 and 540 series FIB-SEMs for nanotomography and nanofabrication.

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SUSS MicroTec launches projection scanner for advanced packaging

Published: March 24, 2014

SUSS MicroTec, Germany, has launched the DSC300 Gen2 projection scanner, a platform for wafer sizes up to 300 mm based on the projection lithography technology developed by SUSS MicroTec Photonic Systems Inc. (formerly Tamarack Scientific).

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Directed self-assembly developed to advance semiconductor manufacturing

Published: March 24, 2014

Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., announces that researchers it sponsors at the Massachusetts Institute of Technology have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components.

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Oxide nanosheets enable capacitance with 2000 times higher stability

Published: March 24, 2014

Researchers at the Japan National Institute for Materials Science, International Center for Materials Nanoarchitectonics, and Shinshu University in Japan report that they have developed high-performance ultrathin capacitors.

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Graphene-coated copper wire dissipates heat 25% faster

Published: March 24, 2014

Researchers at the University of California Riverside, and the University of Manchester, U.K., report that that a sandwich made of graphene on both sides of a sheet of copper improves the copper's ability to dissipate heat by 25%.

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Applied Materials and Tokyo Electron to merge

Published: March 24, 2014

Applied Materials Inc., Santa Clara, Calif., and Tokyo Electron Ltd., report that they have received notice from the Committee on Foreign Investment in the United States (CFIUS) that there are no unresolved national security issues relating to the proposed business combination announced last year.

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