Coater/Developer system designed for fan-out wafer-level packaging

Published: May 19, 2014

Suss MicroTec, Germany, recently introduced a coater/developer tool especially developed to process wafers for fan-out wafer-level packaging applications.

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DCG nProber II system can isolate electrical faults to the sub-transistor level

Published: April 23, 2014

DCG Systems, Fremont, Calif., announces that three of its nProber II nanoprobing systems have been purchased by a major IC manufacturer who is developing technology beyond the 14nm node.

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Oxford Asylum’s MFP-3D Infinity AFM reduces XY sensor noise by 70%, Z-sensor noise by 85%

Published: April 21, 2014

Oxford Instruments Asylum Research, Goleta, Calif., announces the new MFP-3D Infinity Atomic Force Microscope (AFM).

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Global Foundries and Samsung form joint program for 14nm FinFETs

Published: April 21, 2014

Global Foundries, Austin, Texas, and Samsung, Japan, announce a joint program for fabless companies to skip the 20nm node and move straight to 14nm FinFETs.

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Materion to partner with AristoCast for AlBeCast investment castings

Published: April 21, 2014

Materion Brush Beryllium & Composites, a Materion Corporation business, Elmore, Ohio, announces that it has qualified and entered into a strategic manufacturing and marketing partnership with Aristo Cast Inc.

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Silver-filled adhesive film enables high-temperature operation

Published: April 21, 2014

The Advanced Circuit Materials Division of Rogers Corp., Rogers, Conn., launches Coolspan thermally and electrically conductive adhesive (TECA) film.

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Altera and Intel to collaborate on multi-die devices

Published: April 21, 2014

Altera Corp., San Jose, Calif., and Intel Corp., Santa Barbara, Calif., announce their collaboration on the development of multi-die devices that leverage Intel's world-class package and assembly capabilities and Altera's leading-edge programmable logic technology.

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Erbium-antimony nanostructures manipulate light in the infrared range

Published: April 21, 2014

Researchers at the University of California at Santa Barbara have developed an erbium-antimony semiconductor of nearly perfect quality that can manipulate light energy in the mid-infrared range.

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Scalable CVD process enables one atom-thick layers of molybdenum diselenide semiconductor

Published: April 21, 2014

Researchers at Rice University in Houston and Nanyang Technological University in Singapore have developed a potentially scalable CVD method for making one-atom-thick layers of molybdenum diselenide.

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Bruker Introduces online XRF coating analyzer

Published: April 21, 2014

Bruker Corp., Santa Barbara, Calif., presents an online coating analyzer, the S2 Kodiak, which is based on X-ray fluorescence spectrometry.

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