U.S. Navy awards $9,962,646 IDIQ to NTS

Published: February 08, 2022

National Technical Systems Inc., Anaheim, Calif., the leading independent provider of qualification testing, inspection, and certification solutions in North America, has been awarded a $9,962,646 contract from the United States Navy.

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ESi opens a new office in Denver

Published: February 08, 2022

Engineering Systems Inc., Atlanta, announced the opening of a new office in the greater Denver area.

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JEOL introduces new scanning electron microscope with “Simple SEM” automation and live elemental and 3D analysis

Published: February 08, 2022

JEOL, Japan, introduced its latest scanning electron microscope, the JSM-IT510 featuring productivity enhancing automation, “Simple SEM” automated imaging, automated montaging (both image and energy dispersive x-ray spectrometer map), and live EDS analysis (spectrum and map).

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Plastometrex secures Innovate UK funding

Published: February 08, 2022

Plastometrex, a materials science company based in Cambridge, England, has launched an Innovate UK-funded program to tackle the problem of in-field metal strength testing.

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Advantest introduces semiconductor industry’s fastest image processing engine for testing CIS devices used in high resolution smart phones

Published: January 20, 2022

Advantest Corporation, Tokyo, Japan, has begun shipping the fourth generation of its high-speed image-processing engine that applies heterogeneous computing technology to detect defects in the data output from today's most advanced CMOS image sensors.

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Research collaboration to accelerate heterogeneous chip integration with hybrid bonding technology

Published: January 20, 2022

Applied Materials Inc., Santa Clara, Calif., and the Institute of Microelectronics, a research institute of Singapore’s Agency for Science, Technology and Research, announced a new phase of their research collaboration at the Center of Excellence in Advanced Packaging in Singapore.

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Hitachi launches two new FE-SEM models to support data-driven R&D

Published: January 20, 2022

Hitachi High-Tech Corp., Tokyo, launched two cutting-edge field-emission scanning electron microscope models, the SU8600 and SU8700 that feature new detectors, capabilities, advanced automation, and more.

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EDAX adds Velocity Pro to its EBSD camera series

Published: January 20, 2022

Ametek EDAX, Mahwah, N.J., a leader in x-ray microanalysis and electron diffraction instrumentation, is adding a new, fast, low-noise CMOS camera to its Velocity Electron Backscatter Diffraction camera series.

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FormFactor opens new manufacturing facility to expand capacity for semiconductor wafer probe card production

Published: January 20, 2022

FormFactor Inc., Livermore, Calif., a leading semiconductor test and measurement supplier, announced the opening of a new manufacturing facility, expanding its Livermore campus.

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WPI receives $1 million for new semiconductor security research center

Published: January 20, 2022

The Baker-Polito Administration announced a new $999,963 grant from the Collaborative Research and Development Matching Grant program to support a new research center at Worcester Polytechnic Institute, Worcester, Mass., focused on the security of semiconductors and hardware critical to key innovation industries.

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