Leica Microsystems LIBS enables visual and chemical inspection in one step

Published: January 10, 2020

Leica Microsystems, Morrisville, N.C., offers an additional function to optical analysis for determination of cleanliness in materials: laser induced breakdown spectroscopy (LIBS), a chemical analysis tool based on laser technology.

News, Magazine & Media / Industry News

Allied High Tech Products develops sample preparation method for TEM analysis

Published: January 08, 2020

Materials engineer Pablo Mendoza of Allied High Tech Products Inc., Rancho Dominguez, Calif., presented an effective method of sample preparation for transmission electron microscopy at the ASM International MS&T 2019 Exposition in Portland, Ore.

News, Magazine & Media / Industry News

Bruker PeakForce Tapping atomic force microscope celebrates ten years of research

Published: December 17, 2019

Bruker, Billerica, Mass., announces the ten-year anniversary of PeakForce Tapping, its proprietary atomic force microscopy mode that has been widely adopted in materials and semiconductor research.

News, Magazine & Media / Industry News

Hitachi CD Measurement SEM enables EUV lithography production of 5nm devices

Published: December 17, 2019

Hitachi High-Technologies Corp., Tokyo, announces that it has developed an advanced CD Measurement SEM (CD-SEM), the CG7300, which provides enhanced high-precision measurement and improved throughput performance.

News, Magazine & Media / Industry News

Ametek completes acquisition of Gatan for its advanced analytical/testing instrumentation

Published: December 16, 2019

Ametek Inc., Berwyn, Pa., announces that it has completed its acquisition of Gatan, a leading manufacturer of instrumentation and software for enhancing and extending the operation and performance of electron microscopes.

News, Magazine & Media / Industry News

Oxford Instruments supplies plasma etch/deposition solutions to Taiwan company

Published: December 16, 2019

Oxford Instruments Plasma Technology, England, announces that HLJ Technology Co. Ltd., Taiwan, has selected multiple Oxford Instruments Inductively Coupled Plasma (ICP) etch and Plasma Enhanced Chemical Vapor Deposition (PECVD) systems on cluster platforms for the production of six-inch VCSEL wafers.

News, Magazine & Media / Industry News

Ultra Tec Top Surface Scanning improves final backside prep of packaged die

Published: December 16, 2019

Ultra Tec., Santa Ana, Calif., announces that a new physical-contact Top Surface Scanning mode joins the feature set on Ultra Tec’s ASAP-1 in situ selected area prep system.

News, Magazine & Media / Industry News

Thermo Fisher Scientific designs Metrios AX S/TEM to improve semiconductor failure analysis

Published: December 16, 2019

Thermo Fisher Scientific, Portland, Oregon, announces the Thermo Scientific Metrios AX, the world's first commercially released scanning transmission electron microscope (S/TEM) to use machine learning to automate high-quality data collection.

News, Magazine & Media / Industry News

Murata multi-layer ceramic capacitor is 50 times smaller than conventional capacitors

Published: December 16, 2019

Murata Electronics North America, Smyrna, Ga., announces that the company has developed the world’s first multi-layer ceramic capacitor, with 0.1μF dimensions of 0.25×0.125 mm.

News, Magazine & Media / Industry News

Semiconductor sales increase 2.9% in October; 2019 sales projected to decrease by 12.8%

Published: December 16, 2019

The Semiconductor Industry Association (SIA), Washington, reports that worldwide sales of semiconductors reached $36.6 billion for the month of October 2019, an increase of 2.9 percent from the previous month’s total of $35.6 billion.

News, Magazine & Media / Industry News