Grupo Mess becomes exclusive Buehler distributor for metallographic and hardness equipment in Mexico

Published: January 22, 2020

Buehler, an ITW Company, Lake Bluff, Ill., announces a partnership with Grupo Mess, Queretaro City, Mexico, a leading Mexico supplier of scientific equipment and services specializing in metrology. The partnership provides local support to Buehler customers and other manufacturers for all their metallographic product and service needs.

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Women In Engineering Profile: Janet Gbur

Published: January 21, 2020

This profile series introduces leading materials scientists from around the world who happen to be females. Here we speak with Janet Gbur, research associate at Case Western Reserve University, Cleveland, investigator at the Louis Stokes VA Medical Center, Cleveland, and adjunct faculty at Youngstown State University, Youngstown, Ohio.

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Suss MicroTec and BRIDG join to enable semiconductor process and product innovations

Published: January 19, 2020

Suss MicroTec, Corona, Calif., and BRIDG, a public-private partnership in Kissimmee, Fla., have agreed to establish a production-level Applications Center in Kissimmee to enable process and product innovations for Suss customers and BRIDG partners.

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Global semiconductor sales decrease slightly month-to-month in November

Published: January 19, 2020

The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors reached $36.7 billion for the month of November 2019, a decrease of 0.3 percent from the previous month’s total, and 10.8 percent lower than the November 2018 total of $41.1 billion.

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Picosun’s ALD technology enables 3D silicon-integrated microcapacitors

Published: January 18, 2020

Picosun Group, Espoo, Finland, reports record performance of silicon-integrated, three-dimensional deep trench microcapacitors manufactured by its ALD equipment, which deposited film stacks of conductive TiN and insulating dielectric Al2O3 and HfAlO3 layers into high aspect-ratio (up to 100) trenches etched into silicon.

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Witec wins innovation award for Particle Scout, a software tool for microparticle analysis

Published: January 18, 2020

Witec, Germany, announces that it has won The Analytical Scientist Innovation Award as one of the most inventive scientific products of 2019 for Particle Scout, a software tool that enables researchers to find, classify, quantify, and identify particles with unprecedented speed and ease of use.

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Semiconductor materials market to grow to nearly $50 billion in 2020 after 2019 downturn

Published: January 18, 2020

Techcet CA LLC, San Diego, predicts that global revenues for semiconductor manufacturing and packaging materials will grow 5.7% year-over-year in 2020 to $49.5B, of which 65% represents semiconductor fab materials.

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IBM and Hamamatsu develop prototype of a scanning time-resolved emission system

Published: January 18, 2020

Researchers from IBM and Hamamatsu presented a discussion at the ASM International ISTFA 2019 Conference about the first prototype of a Scanning Time-Resolved Emission system for detecting single photons.

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Imec measures optical-beam induced resistance change to localize pinhole breakdown sites

Published: January 14, 2020

Researchers from Imec and KU Leuven University, Belgium, reported on and demonstrated a new methodology for the localization of dielectric breakdown sites in through-silicon via structures at the ASM International ISTFA 2019 conference in Portland, Ore.

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Johns Hopkins scientists develop process for 3D printing gallium nitride semiconductors

Published: January 12, 2020

Researchers at the Johns Hopkins Applied Physics Laboratory (APL) in Laurel, Md., have demonstrated a novel and groundbreaking way to additively print gallium nitride based on a combination of liquid and gas.

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