Cree to invest one billion dollars to build silicon carbide plant in upstate New York

Published: October 10, 2019

Electronics manufacturer Cree Inc., Durham, N.C., announces plans to establish the world’s largest silicon carbide fabrication facility in upstate New York, just outside the city of Utica.

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Cost-effective thermal barrier coating made of one-micron YSZ powder suspended in water

Published: October 03, 2019

Engineers from the Fraunhofer Institute for Material and Beam Technology IWS Dresden, Germany, report that they have developed a new ceramic heat shield technology in which a fine powder of yttrium-stabilized zirconium oxide (YSZ) is added to water to form a suspension.

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Study aims to find optimized electron energy range for voltage contrast in failure analysis

Published: September 21, 2019

Researchers from JEOL Ltd., Japan, and JEOL USA, Peabody, Mass., will present a discussion about voltage contrast (VC) observation using a scanning electron microscope (SEM) and focused ion beam (FIB) at the ISTFA 2019 conference in November in Portland, Oregon.

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Creative manual diagnosis approach combines FA techniques to determine root cause

Published: September 21, 2019

Researchers from ON Semiconductor, Belgium, will present a paper at the ISTFA 2019 conference in November in Portland, Oregon, which covers a creative manual diagnosis approach to failure analysis.

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Wafer surface measurement based on capacitance technology generates 3D images

Published: September 20, 2019

MTi Instruments, Albany, N.Y., has developed the Proforma 300i SA, a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials.

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Bruker D8 Discover Plus x-ray diffraction instrument features highly parallel x-ray beam

Published: September 20, 2019

Bruker Corp., Billerica, Mass., has released the D8 Discover Plus x-ray diffraction (XRD) solutions, featuring the new non-coplanar arm and the Montel Plus x-ray optics.

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Zeiss Xradia RepScan measures submicron dimensions of buried features in packages

Published: September 20, 2019

Zeiss, Pleasanton, Calif., introduces the Zeiss Xradia 620 Versa RepScan, a submicron-resolution, 3D nondestructive imaging solution for inspection and measurement that accelerates time to market for advanced IC packages.

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Imec develops improved test vehicle for localization of dielectric breakdown sites

Published: September 18, 2019

Imec, Belgium, has developed a dual-damascene 21nm-pitch test vehicle relevant for manufacturing the 3nm logic technology node.

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Picosun plasma-enhanced ALD enables materials deposition at lower temperatures

Published: September 18, 2019

Picosun Group, Finland, reports excellent results with its next generation R&D PEALD (plasma-enhanced ALD) technology, which enables deposition at low temperatures and of several materials that could not be deposited with thermal processes only.

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SEMI World Fab Forecast predicts new fab projects will reach nearly $50 billion in 2020

Published: September 18, 2019

Semi, Milpitas. Calif., reports in its World Fab Forecast that investments in new fab projects starting construction in 2020 are expected to reach nearly $50 billion, up about $12 billion from 2019.

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