Ametek Edax OIM Matrix software enables EBSD simulations and dictionary indexing

Published: August 15, 2019

Ametek Edax Inc., Mahwah, N.J., introduces the OIM Matrix software package, which brings dynamic diffraction-based electron backscatter diffraction (EBSD) pattern simulations and dictionary indexing capabilities to the EBSD market.

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Rigaku X-ray microscope with rotating anode enables 3D images of semiconductors

Published: August 15, 2019

Rigaku Corp., Japan, introduces the Nano3DX, a true X-ray microscope with the ability to deliver 3D computed tomography images of relatively large samples at high resolution.

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Cree to invest $1 billion to grow its Wolfspeed silicon carbide and GaN-on-SiC business

Published: August 14, 2019

Cree Inc., Durham, N.C., announces plans for a $1 billion investment to its headquarters in Durham to expand the company’s silicon carbide materials capabilities and wafer fabrication capacity.

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Thermo Scientific Meridian S enables isolation of electrical faults in semiconductors

Published: August 14, 2019

Thermo Scientific, Hillsboro, Oregon, announces that with the new Thermo Scientific Meridian S inverted static Optical Fault Isolation (OFI) solution, semiconductor failure analysis labs can future-proof their operations with a fully scalable solution.

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Semi 2019 Mid-Year Total Equipment Forecast: 2019 market reset with 2020 recovery

Published: August 14, 2019

Semi, San Francisco, projects that global sales of semiconductor manufacturing equipment by original equipment manufacturers will drop by 18.4 percent to $52.7 billion in 2019 from last year’s historic high of $64.5 billion in its Mid-Year Total Equipment Forecast.

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Maser Engineering’s MIP machine expands decapsulation capability for failure analysis

Published: August 13, 2019

Maser Engineering, the Netherlands, announces that it has further strengthened its capabilities in semiconductor failure analysis by acquiring a second microwave-induced-plasma (MIP) decapsulation machine from Jiaco Instruments, also of the Netherlands.

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Specially designed Zeiss camera lenses traveled with Apollo 11 to the Moon 50 years ago

Published: July 19, 2019

Zeiss, Oberkochen, Germany, reports that in October 1968, the company received the order for a camera lens to be used during the Moon landing, which was scheduled to take place a mere nine months later as part of the Apollo 11 mission.

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GlobalFoundries, Soitec sign supply agreements for 300-mm wafers to meet market demand

Published: July 18, 2019

GlobalFoundries, Santa Clara, Calif., and Soitec, France, have signed multiple long-term supply agreements for 300-mm silicon-on-insulator wafers to secure the high-volume supply needed to meet the growing demand for its differentiated radio-frequency-silicon-on-insulator, fully-depleted-silicon-on-insulator, and silicon photonics technology platforms.

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Thermo Scientific Helios Hydra DualBeam SEM delivers four different ions as primary beam

Published: July 18, 2019

Thermo Scientific, Hillsboro, Oregon, announces that researchers can now apply a range of ion beam species within one focused ion beam scanning electron microscope with the new Helios Hydra DualBeam system.

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Advantest V93000 Wave Scale Millimeter Solution is finalist in Best of West awards

Published: July 17, 2019

SEMI Americas, Milpitas, Calif., and Semiconductor Digest announce that Advantest, Tokyo, was a finalist in the Best of West awards for its V93000 Wave Scale Millimeter Solution, which has been extended to support multi-band testing at the fast interface speeds used by 5G devices.

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