SRC sponsors semiconductor packaging research center at Purdue and Binghamton

Published: February 17, 2019

Purdue University, West Lafayette, Ind., announces the formation of the Center for Heterogeneous Integration Research in Packaging, or CHIRP, a new multimillion dollar semiconductor research center that will be co-directed by Ganesh Subbarayan, professor of mechanical engineering at Purdue, and Bahgat Sammakia, vice president for research and a distinguished professor of mechanical engineering at Binghamton University, New York.

News, Magazine & Media / Industry News

Global semiconductor sales increase by 13.7% in 2017 to $468.8 billion in 2018

Published: February 17, 2019

The Semiconductor Industry Association (SIA), Washington, representing U.S. leadership in semiconductor manufacturing, design, and research, announces that the global semiconductor industry posted sales of $468.8 billion in 2018, the industry’s highest-ever annual total and an increase of 13.7 percent compared to the 2017 total.

News, Magazine & Media / Industry News

Bruker introduces Skyscan benchtop 3D x-ray microscope with three-micron voxel size

Published: February 17, 2019

Bruker, Belgium, introduces the Skyscan 1273 benchtop 3D x-ray microscope based on micro-computed tomography technology, enabling samples with up to 500 mm length, 300 mm diameter, and a maximum weight of 20 kg to be investigated with powerful and precise positioning stages.

News, Magazine & Media / Industry News

Zeiss launches 3D x-ray imaging solutions for failure analysis of semiconductors

Published: February 17, 2019

Zeiss, Germany, announces that a new suite of 3D x-ray imaging solutions that provide submicron and nanoscale 3D images of features and defects buried within intact structures in advanced package 3D architectures has been developed by its scientists: Xradia Context microCT, Xradia 600-series Versa 3D XRM, and Xradia 800-series Versa 3D XRM.

News, Magazine & Media / Industry News

STEM microscope generates two electron beams to make holographs of atomic structure

Published: February 17, 2019

The University of Oregon, Eugene, announces that its researchers have created STEM holography, a new technique that provides improved atomic resolution of a sample's outer structure and unveils previously unseen interfaces between the sample surface and the underlying material.

News, Magazine & Media / Industry News

Keyence VHX 6000 microscope combines brightfield and darkfield for optimal lighting

Published: January 21, 2019

Keyence, Japan, offers the VHX-6000 digital microscope with the capability to view, capture, and measure at magnifications ranging from 20X to 2000X.

News, Magazine & Media / Industry News

Atomic force microscope from Asylum Research scans surface ten times faster at high resolution

Published: January 21, 2019

Oxford Instruments Asylum Research, U.K., introduces the Cypher VRS AFM, a full-featured video-rate atomic force microscope that enables researchers to measure nanoscale dynamic processes at video-rate speeds with all of the resolution, versatility, and ease of use of an Asylum Research Cypher AFM.

News, Magazine & Media / Industry News

Veeco wins Innovation Award for its GENxcel R&D molecular beam epitaxy system

Published: January 19, 2019

Veeco Instruments Inc., Plainview, N.Y., announces that its GENxcel R&D Molecular Beam Epitaxy System earned the 2018 Compound Semiconductor (CS) Industry Innovation Award.

News, Magazine & Media / Industry News

Thermo Scientific’s Lumis EBSD detector incorporates new CMOS sensor, advanced optics

Published: January 19, 2019

Thermo Scientific, Waltham, Mass., introduces the Lumis EBSD detector, which can rapidly identify crystallographic phases, grain sizes, and orientation, as well as monitor structural transformations in SEM samples.

News, Magazine & Media / Industry News

Zeiss invests $45 million in facility near Detroit for metrology and nondestructive testing

Published: January 19, 2019

Zeiss, Germany, has begun construction of a new 82,000 square foot facility outside Detroit that will be capable of surface defect detection, multidimensional measurement, nondestructive testing, and surface form and geometry analysis.

News, Magazine & Media / Industry News