DualBeam FIB-SEM microscope for semiconductors includes new feedback systems

Published: March 21, 2019

Thermo Fisher Scientific, Waltham, Mass., introduces its latest and most advanced focused ion beam scanning electron microscope (FIB-SEM) for nanometer scale materials characterization and analysis: the Thermo Scientific Helios 5 DualBeam microscope.

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Fujifilm Electronic Materials invests $91 million to expand manufacturing in Arizona

Published: March 11, 2019

Fujifilm Electronic Materials U.S.A., a subsidiary of Tokyo-based Fujifilm Holdings Corp., recently began a $91 million investment project focused on the company's manufacturing and development facilities in Mesa, Arizona.

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Asylum Research Jupiter AFM provides 200-mm sample access and higher resolution

Published: March 11, 2019

Oxford Instruments Asylum Research, Santa Barbara, Calif., announces the new Jupiter XR Atomic Force Microscope, the first and only large-sample AFM to offer both high-speed imaging and extended range in a single scanner.

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Mineral and organic acids extract rare earth elements from phosphate rock waste

Published: March 11, 2019

Researchers from Rutgers University-New Brunswick, N.J., and members of the Critical Materials Institute in Ames, Iowa, announce that they have found a possible new source of rare earth elements in phosphate rock waste, and have developed an environmentally friendly way to extract the elements.

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Buehler’s new Wilson universal hardness testers can hold several indenters and objectives

Published: February 20, 2019

Buehler, Lake Bluff, Ill., introduces the Wilson UH4000 series universal hardness testers, which are designed for high-volume production labs and the production floor.

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Buehler AutoMet grinder-polishers feature intuitive touch screen, z-axis material removal

Published: February 19, 2019

Buehler, Lake Bluff, Ill., an ITW company, introduces the AutoMet family of semi-automatic grinder-polishers that feature a new intuitive touch screen interface that is simple to learn and quick to operate.

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Rigaku and Fraunhofer partner to expand x-ray topography for semiconductor wafers

Published: February 19, 2019

Rigaku Europe SE and Fraunhofer IISB, both in Germany, announce the formation of a strategic partnership to revolutionize the characterization of semiconductor materials by x-ray topography.

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Soitec expands collaboration with Samsung Foundry on fully depleted SOI wafer supply

Published: February 19, 2019

Soitec, France, announces an expanded collaboration with Samsung Foundry to ensure the volume supply of fully depleted silicon-on-insulator (FD-SOI) wafers.

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Ultra Tec introduces expanded software toolkit and interactive graphics for IC processing

Published: February 18, 2019

Ultra Tec Manufacturing Inc., Santa Ana, Calif., announces the availability of a greatly expanded software toolkit for its ASAP-1 In Situ 5-axis mill and selected area polishing station.

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ST Microelectronics to acquire majority stake in wafer manufacturer Norstel AB

Published: February 17, 2019

ST Microelectronics, Geneva, has signed an agreement to acquire a majority stake in Swedish silicon carbide wafer manufacturer Norstel AB. After closing, ST will control the entire supply chain for a portion of its SiC devices at a time of constrained global capacity, positioning itseIf for a significant growth opportunity.

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