Rohm and GaN Systems collaborate for R&D to improve GaN power semiconductors

Published: June 25, 2018

Rohm Semiconductor, Kyoto, and GaN Systems, Ottawa, announce their collaboration in the GaN (gallium nitride) power semiconductor business, with the goal of contributing to the continuing evolution of power electronics.

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Applied Materials replaces copper with cobalt for transistor contacts and interconnects

Published: June 25, 2018

Applied Materials Inc., Santa Clara, Calif., announces a breakthrough in materials engineering in which cobalt replaces tungsten and copper for transistor contacts and interconnects.

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Entegris to acquire SAES Pure Gas business for semiconductor manufacturing

Published: June 24, 2018

Entegris, Billerica, Mass., a distributor of specialty chemicals and advanced materials solutions, announces that it has entered into a definitive agreement to acquire the SAES Pure Gas business from SAES Getters S.p.A. in Milan, Italy.

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Semiconductor equipment record spending streak to continue through 2019

Published: June 24, 2018

SEMI, Milpitas, Calif., reports that the semiconductor industry is nearing a third consecutive year of record equipment spending with projected growth of 14 percent (YOY) in 2018 and 9 percent in 2019.

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Two Shimadzu analytical instruments win 2018 Red Dot Award for product design

Published: June 24, 2018

Shimadzu Scientific Instruments, Japan, announces that two Shimadzu analytical instruments have been awarded the Red Dot Award for Product Design 2018, a prestigious and internationally recognized German design award.

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Ultra Tec in situ interferometer enables measurement of through-silicon thickness

Published: June 24, 2018

Ultra Tec, Santa Ana, Calif., adds an in situ Interferometer, ASAP-1 IPS, to its IPS selected Area Preparation tool, enabling it to measure through-silicon thickness, in addition to the coordinate measurement systems already on board.

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ON Semiconductor to invest $51 million in Pennsylvania semiconductor plant expansion

Published: June 24, 2018

ON Semiconductor, Phoenix, Ariz., plans to invest $51 million to support expansion of its facility in Mountain Top, Pa., which specializes in the manufacture of semiconductor discrete devices for power management applications across a wide variety of industries, including automotive, industrial, communication, and computing.

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Bruker optical surface profiler enables large field of view at high scanning speeds

Published: June 24, 2018

Bruker, Santa Clara, Calif., reports that its new Contour LS-K 3D Optical Profiler utilizes LightSpeed focus variation technology to uniquely enable both high-resolution images and quantifiable data.

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Edax electron-beam backscatter diffraction camera enables accurate phase differentiation

Published: June 24, 2018

Edax Inc., Mahwah, N.J., has launched its new Velocity electron beam backscatter diffraction (EBSD) camera, which offers high-speed EBSD mapping with the highest indexing performance on real-world materials.

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ARL’s nanogalvanic aluminum powder mixed with water rapidly generates hydrogen gas

Published: June 19, 2018

The U.S. Army Research Laboratory (ARL) , Aberdeen Proving Ground, Md., announces that its researchers have developed a novel, structurally-stable, aluminum-base nanogalvanic alloy powder that reacts with water to produce hydrogen on-demand without a catalyst.

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