Cohu to acquire Xcerra for its back-end semiconductor test and inspection equipment

Published: May 21, 2018

Cohu Inc., Poway, Calif., and Xcerra Corp., Norwood, Mass., have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock.

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EV Group to expand manufacturing facility for wafer bonding, lithography equipment

Published: May 21, 2018

EV Group, Austria, has started construction work for its Manufacturing III facility, the next expansion phase of its corporate headquarters.

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Burloak Technologies to invest $81.5 million in additive manufacturing center in Ontario

Published: May 20, 2018

Burloak Technologies, a division of Samuel, Son & Co., Dundas, Ontario, is investing a total of $81.5 million in a new Additive Manufacturing Technology Center in Oakville, Ontario.

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Leica Center of Excellence in microscopy launched at California NanoSystems Institute

Published: May 20, 2018

The University of California at Los Angeles, in collaboration with Leica Microsystems Inc., Germany, has established the Leica Center of Excellence at UCLA to fast-track the commercial development of new optical microscopy tools and methods.

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Silverchair to provide hosting for ASM’s online materials information resources

Published: May 18, 2018

Silverchair Information Systems, Charlottesville, Va., announces a partnership with ASM International, Cleveland, to develop a unified hosting solution for ASM’s authoritative materials information resources.

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Alcoa, RioTinto join to develop aluminum smelting process that emits only oxygen gas

Published: May 14, 2018

Alcoa Corp., Pittsburgh, and Rio Tinto, London, announce a revolutionary aluminum smelting process that produces oxygen and eliminates all direct greenhouse gas emissions.

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JEOL adds new monochromated ARM200F to its atomic-resolution TEM family

Published: May 07, 2018

JEOL USA, Peabody, Mass., introduces the new JEM-ARM200F atomic resolution analytical transmission electron microscope that achieves a guaranteed high angle annular dark field resolution of 80 picometers.

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Edwards Vacuum breaks ground on Technology Innovation Center in Hillsboro

Published: April 24, 2018

Edwards Vacuum, England, has begun the process of construction for a new Technology Innovation Center in Hillsboro, Oregon.

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Versum Materials opens Pennsylvania R&D center for semiconductor materials development

Published: April 23, 2018

Versum Materials Inc., Tempe, Ariz., a leading materials supplier to the semiconductor industry, announces the grand opening of its new R&D facility at its semiconductor materials manufacturing site in Hometown, Pennsylvania.

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Functional electronic circuits made via additive manufacturing and 2D printing

Published: April 23, 2018

The University of Nottingham, England, reports that its researchers have pioneered a breakthrough method to rapidly 3D print fully functional electronic circuits made up of electrically-conductive metallic inks and insulating polymeric inks.

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