GlobalFoundries, Ayar Labs collaborate to develop ten times higher bandwidth

Published: December 18, 2017

GlobalFoundries and Ayar Labs, a startup bringing optical input/output (I/O) to silicon chips, announce a strategic collaboration to co-develop and commercialize differentiated silicon photonic technology solutions.

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ProPlus and MPI establish strategic partnership to integrate and optimize technologies

Published: December 18, 2017

ProPlus Design Solutions Inc., San Jose, Calif., and MPI Corp., Taiwan, announce a strategic partnership agreement and immediate availability of a characterization and modeling solution that integrates the ProPlus Spice modeling and noise characterization solution with MPI’s advanced probing technologies.

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CVD buys 180,000 sq. ft. facility to manufacture composites and electronic materials

Published: December 18, 2017

CVD Equipment Corp., Ronkonkoma, N.Y., a provider of chemical vapor deposition systems and materials, announces that it has completed the purchase of the company’s planned additional facility in Central Islip, New York.

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Invensas completes direct bond technology transfer to Teledyne DALSA

Published: December 18, 2017

Invensas, San Jose, Calif., a wholly owned subsidiary of Xperi Corp., announces the successful technology transfer of its Direct Bond Interconnect to Teledyne DALSA, a Teledyne Technologies company.

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Olympus MX63 microscope systems optimized for analysis of large wafers, circuit boards

Published: December 18, 2017

Olympus Scientific Solutions Corp., Waltham, Mass., announces that the MX63 and MX63L microscope systems are optimized for high-quality inspections of wafers as large as 300 mm, flat panel displays, circuit boards, and other large samples.

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Hirox 3D digital microscope features zoom technologies, precision mechanisms

Published: December 18, 2017

Hirox-USA, Hackensack, N.J., introduces the RH-2000 3D digital microscope, which features high-performance lenses with incorporated zoom technologies, built-in illumination, and precision mechanisms.

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Rudolph Technologies NSX 330 Series combines defect inspection and metrology

Published: December 18, 2017

Rudolph Technologies, Flanders, N.J., introduces the NSX 330 Series, which combines defect inspection with 2D and 3D metrology.

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New XRD system combines Turbo X-ray source, Eiger photon detector, Atlas goniometer

Published: November 08, 2017

Bruker AXS, Billerica, Mass., announces that its new D8 Discover Plus X-ray diffraction system combines the high power of the TXS-HE high-efficiency Turbo X-ray Source, with the large detection area and dynamic range of the Eiger2 R 500K multi-mode hybrid photon counting detector, and the high-endurance Atlas goniometer.

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Biography Highlights Inspirational Life of Scientist and Educator Y. Austin Chang

Published: November 07, 2017

Emigrating from China to the US in 1950, Y. Austin Chang obtained a PhD in metallurgy and became a world-renowned expert in thermodynamics and metal alloys. In addition to his scientific accomplishments, his role as a beloved educator, mentor, and devoted family man is told in this warm biography.

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Buehler introduces Ecomet 30 robust semi-automatic and manual grinder/polisher

Published: November 07, 2017

Buehler Ltd., Lake Bluff, Ill., introduces the EcoMet 30 semi-automatic and manual grinder and polisher for service in heat treat, automotive, aerospace, and electronic laboratory environments where fast, reliable results are required.

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