Department of Energy invests $17.4 million to advance recovery of rare earths from coal

Published: October 30, 2017

The U.S. Department of Energy, Washington, has selected four projects to move on to a second phase of research in its effort to advance recovery of rare earth elements from coal and coal byproducts.

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Picosun’s ALD nanolaminates improve lifetime and reliability of electronic circuit boards

Published: October 24, 2017

Picosun Oy, Finland, reports that it has developed atomic layer deposition technology in which nanolaminates specifically tailored to form dense, conformal, and hermetic seals are deposited on printed circuit board assemblies (PCBA).

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Carbon nanotube fiber antennas work as well as copper at 20 times lower weight

Published: October 24, 2017

Rice University, Houston, announces that its researchers have determined that fibers made of carbon nanotubes configured as wireless antennas can be as good as copper antennas but 20 times lighter.

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IC makers maximize 300mm and 200mm wafer capacity

Published: October 23, 2017

IC Insights Inc., Scottsdale, Ariz., reports that, with the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates.

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Samsung completes qualification of 8nm LPP process

Published: October 23, 2017

Samsung Electronics Co. Ltd., South Korea, announces that 8nm FinFET process technology, 8LPP (Low Power Plus), has been qualified and is ready for production.

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Hamamatsu acquires Energetiq for its high-brightness light sources for wafer inspection

Published: October 23, 2017

Hamamatsu Photonics KK, Japan, announces an agreement to acquire Energetiq Technology Inc., Woburn, Mass., for its laser-driven light sources and extreme-ultraviolet light sources.

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High-precision SPMs based on superconducting magnets from Oxford Instruments

Published: October 23, 2017

Oxford Instruments NanoScience, England, announces it will jointly develop high-precision scanning probe microscope products based on TeslatronPT, the Cryofree superconducting magnet system from Oxford Instruments, in collaboration with CASmF Science and Technology Limited in China.

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Allied’s X-Prep CNC-based system supports failure analysis with high-definition color

Published: October 23, 2017

Allied High Tech, Rancho Dominguez, Calif., introduces the X-Prep, a specialized five-axis CNC-based milling/grinding/polishing machine designed to support electrical and physical failure analysis techniques requiring high precision sample preparation.

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Thermo Fisher Scientific adds three systems for semiconductor failure analysis

Published: October 23, 2017

Thermo Fisher Scientific, Hillsboro, Ore., announces three new additions to its portfolio of semiconductor failure analysis workflows.

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NanoMechanics Lab enables nanoscale AFM of soft hydrogels, metals, and ceramics

Published: October 20, 2017

Bruker Corp., Santa Barbara, Calif., has released the NanoMechanics Lab, a suite of force-mapping modes that enable Dimension FastScan and Icon AFM systems for quantitative nanoscale characterization, extending from soft hydrogels and polymers to hard metals and ceramics.

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